11. Packaging Information
11.1. 32-pin 32A
TITLE
DRAWING NO.
REV.
32A, 32-lead, 7 x 7mm body size, 1.0mm body thickness,
0.8mm lead pitch, thin profile plastic quad flat package (TQFP)
C
32A
2010-10-20
PIN 1 IDENTIFIER
0°~7°
PIN 1
L
C
A1
A2 A
D1
D
e
E1 E
B
Notes:
1. This package conforms to JEDEC reference MS-026, Variation ABA.
2. Dimensions D1 and E1 do not include mold protrusion. Allowable
protrusion is 0.25mm per side. Dimensions D1 and E1 are maximum
plastic body size dimensions including mold mismatch.
3. Lead coplanarity is 0.10mm maximum.
A 1.20
A1 0.05 0.15
A2 0.95 1.00 1.05
D 8.75 9.00 9.25
D1 6.90 7.00 7.10 Note 2
E 8.75 9.00 9.25
E1 6.90 7.00 7.10 Note 2
B 0.30 0.45
C 0.09 0.20
L 0.45 0.75
e 0.80 TYP
COMMON DIMENSIONS
(Unit of measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
Atmel ATmega48PA/88PA/168PA [DATASHEET]
Atmel-42734B-ATmega48PA/88PA/168PA_Datasheet_Summary-11/2016
22
11.2. 32-pin 32M1-A
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
D1
D
E1
E
e
b
A3
A2
A1
A
D2
E2
0.08
C
L
1
2
3
P
P
0
1
2
3
A 0.80 0.90 1.00
A1 0.02 0.05
A2 0.65 1.00
A3 0.20 REF
b 0.18 0.23 0.30
D
D1
D2 2.95 3.10 3.25
4.90 5.00 5.10
4.70 4.75 4.80
4.70 4.75 4.80
4.90 5.00 5.10
E
E1
E2 2.95 3.10 3.25
e 0.50 BSC
L 0.30 0.40 0.50
P 0.60
12
o
Note : JEDEC Standard MO-220, Fig . 2 (Anvil Singulation), VHHD-2 .
TOP VIEW
SIDE VIEW
BOTTOM VIEW
0
Pin 1 ID
Pin #1 Notch
(0.20 R)
K 0.20
K
K
32M1-A , 32-pad, 5 x 5 x 1.0mm Bod y, Lead Pitch 0.50mm ,
3.10mm Exposed P ad, Micro Lead Frame P a ckage (MLF)
32M1-A
03/14/2014
F
Atmel ATmega48PA/88PA/168PA [DATASHEET]
Atmel-42734B-ATmega48PA/88PA/168PA_Datasheet_Summary-11/2016
23
11.3. 32-pin 32CC1
TITLE
DRAWING NO.GPC
REV.
Package Drawing Contact:
packagedrawings@atmel.com
B
CAG
32CC1, 32-ball (6 x 6 Array), 4 x 4 x 0.6 mm
package, ball pitch 0.50 mm, Ultra Thin,
Fine-Pitch Ball Grid Array (UFBGA)
32CC1
07/06/10
b1
COMMON DIMENSIONS
(Unit of Measure = mm)
1 2 3 4 5 6
B
A
C
D
E
F
E
D
e
32-Øb
E
D
B
A
Pin#1 ID
0.08
A1
A
D1
E1
A2
A1 BALL CORNER
1 2 3 4 5 6
F
C
SIDE VIEW
BOTTOM VIEW
TOP VIEW
SYMBOL
MIN
NOM
MAX
NOTE
Note1:
Dimension “b” is measured at the maximum ball dia. in a plane parallel
to the seating plane.
Note2:
Dimension b1 is the solderable surface def ned by the opening of the
solder resist layer.
e
A – – 0.60
A1 0.12 – –
A2 0.38 REF
b 0.25 0.30 0.35 1
b1 0.25 – – 2
D 3.90 4.00 4.10
D1 2.50 BSC
E 3.90 4.00 4.10
E1 2.50 BSC
e 0.50 BSC
Atmel ATmega48PA/88PA/168PA [DATASHEET]
Atmel-42734B-ATmega48PA/88PA/168PA_Datasheet_Summary-11/2016
24

ATMEGA88PA-PU

Mfr. #:
Manufacturer:
Microchip Technology / Atmel
Description:
8-bit Microcontrollers - MCU 1.8V - 5.5V 20MHz 8KB Programmable
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union