74HC_HCT244 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 4 — 24 September 2012 10 of 18
NXP Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
12. Package outline
Fig 9. Package outline SOT146-1 (DIP20)
UNIT
A
max.
1 2
b
1
cD E e M
H
L
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT146-1
99-12-27
03-02-13
A
min.
A
max.
b
Z
max.
w
M
E
e
1
1.73
1.30
0.53
0.38
0.36
0.23
26.92
26.54
6.40
6.22
3.60
3.05
0.2542.54 7.62
8.25
7.80
10.0
8.3
24.2 0.51 3.2
0.068
0.051
0.021
0.015
0.014
0.009
1.060
1.045
0.25
0.24
0.14
0.12
0.010.1 0.3
0.32
0.31
0.39
0.33
0.0780.17 0.02 0.13
SC-603MS-001
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w M
b
1
e
D
A
2
Z
20
1
11
10
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
(1)
(1) (1)
DIP20: plastic dual in-line package; 20 leads (300 mil)
SOT146-1
74HC_HCT244 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 4 — 24 September 2012 11 of 18
NXP Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
Fig 10. Package outline SOT163-1 (SO20)
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(1) (1)
eH
E
LL
p
Q
Z
ywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
inches
2.65
0.3
0.1
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.1
0.4
SOT163-1
10
20
w M
b
p
detail X
Z
e
11
1
D
y
0.25
075E04 MS-013
pin 1 index
0.1
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.51
0.49
0.30
0.29
0.05
1.4
0.055
0.419
0.394
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
0 5 10 mm
scale
X
θ
A
A
1
A
2
H
E
L
p
Q
E
c
L
v M
A
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
99-12-27
03-02-19
74HC_HCT244 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 4 — 24 September 2012 12 of 18
NXP Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
Fig 11. Package outline SOT339-1 (SSOP20)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(1)
eH
E
LL
p
Q
(1)
Zywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
7.4
7.0
5.4
5.2
0.65
7.9
7.6
0.9
0.7
0.9
0.5
8
0
o
o
0.131.25 0.2 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
1.03
0.63
SOT339-1 MO-150
99-12-27
03-02-19
X
w M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v M
A
(A )
3
A
110
20 11
y
0.25
pin 1 index
0 2.5 5 mm
scale
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm
SOT339-1
A
max.
2

74HC244N,652

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC BUFFER NON-INVERT 6V 20DIP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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