STTH112 Electrical characteristics
Doc ID 9343 Rev 5 3/8
Figure 1. Conduction losses versus average
current
Figure 2. Forward voltage drop versus
forward current
P(W)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
δ = 1
δ = 0.05
δ = 0.5
δ = 0.2
δ = 0.1
I (A)
F(AV)
T
δ
=tp/T
tp
I (A)
FM
0.1
1.0
10.0
100.0
.
.
1.
1.
2.
2.
.
.
4.
4.
.
T =125°C
(maximum values)
j
T =125°C
(typical values)
j
T =25°C
(maximum values)
j
V (V)
FM
Figure 3. Relative variation of thermal
impedance junction ambient versus
pulse duration (DO-41)
Figure 4. Relative variation of thermal
impedance junction ambient versus
pulse duration (epoxy FR4) (SMA)
Z/R
th(j-c) th(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
T
δ
=tp/T
tp
t (s)
p
δ = 0.5
δ = 0.2
δ = 0.1
Single pulse
epoxy FR4, L = 10mm
leads
Z/R
th(j-c) th(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
T
δ
=tp/T
tp
t (s)
p
δ
= 0.5
δ
= 0.2
δ
= 0.1
Single pulse
Figure 5. Relative variation of thermal
impedance junction ambient versus
pulse duration (epoxy FR4)(SMB)
Figure 6. Thermal resistance junction to
ambient versus copper surface
under each lead (DO-41, SMB)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z/R
th(j-c) th(j-c)
T
δ
=tp/T
tp
t (s)
p
δ = 0.5
δ = 0.2
δ = 0.1
Single pulse
R (°C/W)
th(j-a)
0
10
20
30
40
50
60
70
80
90
100
110
012345678910
S(cm²)
DO-41
L =10mm
leads
SMB
epoxy printed circuit board FR4, copper thickness: 35µm