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Rev H
Mounting Configuration:
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be
used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet
published specifications.
All of the Xinger components are constructed from organic PTFE based composites which possess excellent
electrical and mechanical stability. Xinger components are compliant to a variety of ROHS and Green standards and
ready for Pb-free soldering processes. Pads are Gold plated with a Nickel barrier.
An example of the PCB footprint used in the testing of these parts is shown below. An example of a DC-biased
footprint is also shown below. In specific designs, the transmission line widths need to be adjusted to the unique
dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances.
No Bias Footprint
6x .41
6x .33
.04
4x .25
.66
3x Transmission
lines
Plated thru holes to ground
Plated thru
holes to
ground
Circuit Pattern
Footprint Pad (s)
Solder Resist
Mounting Footprint
Dimensions are in Millimeters
PART ORIENTATION
TOP DOWN
DC Bias Footprint
6x .41
6x .33
.04
4x .25
.66
3x Transmission
lines
Plated thru
holes to
ground
Circuit Pattern
Footprint Pad (s)
Solder Resist
Mounting Footprint
Dimensions are in Millimeters
Capacitor
Plated thru
holes to
ground
PART ORIENTATION
TOP DOWN
DC Bias
