AD809BR-REEL7

AD809
REV. A
–3–
Table I.
MUX Input Input Selected
TTL “0” CLKIN/CLKINN
TTL “1” PECLIN/PECLINN
Table II. Applying a PECL/ECL or CMOS/TTL Reference
Input to the AD809
Input Reference AD809 Configuration
PECL/ECL Differential Apply the valid PECL–level reference
frequency to Pins 13 and 12.
AD809 frequency synthesizer ignores
the input at Pin 10.
TTL/CMOS Apply the reference frequency to
Single-Ended Pin 10.
Connect Pins 13 and 12 to AV
EE
(Pins 9 and 16). The AD809 senses
the common-mode signal at these pins
as less than valid PECL and selects the
TTL/CMOS input as active.
AD809 Phase Skew
The AD809 output is in phase with the input. The falling edge
at Pin 4, CLKOUTN, occurs 700 ps before the rising edge at
Pin 10, TTL/CMOSIN at 27°C. The phase skew remains rela-
tively constant over temperature. Refer to Table III for phase
skew data.
Table III. Phase Skew vs. Temperature
Skew (CLKOUTN, Pin 4, Relative to
Temperature TTL/CMOSIN, Pin 10 Measured in
(8C) ps at Package Pins)
–35 –1000
–20 –950
0 –850
10 –750
30 –700
50 –600
70 –450
80 –450
90 –350
100 –250
PIN DESCRIPTIONS
Pin
No. Mnemonic Description
1 PECLINN Differential 155 MHz Input
2 PECLIN Differential 155 MHz Input
3V
CC2
Digital V
CC
for PECL Outputs
4 CLKOUTN Differential 155 MHz Output
5 CLKOUT Differential 155 MHz Output
6V
CC1
Digital V
CC
for Internal Logic
7 CF1 Loop Damping Capacitor
8 CF2 Loop Damping Capacitor
9AV
EE
Analog V
EE
10 TTL/CMOSIN TTL/CMOS Reference Clock Input
11 AV
CC1
Analog V
CC
for PLL
12 CLKINN PECL Differential Reference Clock Input
13 CLKIN PECL Differential Reference Clock Input
14 AV
CC2
Analog V
CC
for Input Stage
15 MUX Input Signal Mux Control Input
16 V
EE
Digital V
EE
PIN CONFIGURATION
14
13
12
11
16
15
10
9
8
1
2
3
4
7
6
5
TOP VIEW
(Not to Scale)
AD809
PECLINN
CLKIN
AV
CC2
MUX
V
EE
PECLIN
V
CC2
CLKOUTN
TTL/CMOSIN
AV
CC1
CLKINN
CLKOUT
V
CC1
CF1
CF2
AV
EE
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD809 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
AD809
REV. A
–4–
DEFINITION OF TERMS
Maximum, Minimum and Typical Specifications
Specifications for every parameter are derived from statistical
analyses of data taken on multiple devices from multiple wafer
lots. Typical specifications are the mean of the distribution of
the data for that parameter. If a parameter has a maximum (or a
minimum), that value is calculated by adding to (or subtracting
from) the mean six times the standard deviation of the distribu-
tion. This procedure is intended to tolerate production varia-
tions: if the mean shifts by 1.5 standard deviations, the remaining
4.5 standard deviations still provide a failure rate of only 3.4
parts per million. For all tested parameters, the test limits are
guardbanded to account for tester variation to thus guarantee
that no device is shipped outside of data sheet
specifications.
Capture and Tracking Range
This is the range of input data rates over which the AD809 will
remain in lock.
Jitter
This is the dynamic displacement of digital signal edges from
their long term average positions, measured in degrees rms.
Jitter on the input clock causes jitter on the synthesized clock.
Output Jitter
This is the jitter on the synthesized clock (OUTPUT, OUTPUT),
in degrees rms.
Jitter Transfer
The AD809 exhibits a low-pass filter response to jitter applied
to its input data.
Bandwidth
This describes the frequency at which the AD809 attenuates
sinusoidal input jitter by 3 dB.
Peaking
This describes the maximum jitter gain of the AD809 in dB.
Damping Factor, z
Damping factor, ζ describes the compensation of the second or-
der PLL. A larger value of ζ corresponds to more damping and
less peaking in the jitter transfer function.
Duty Cycle Tolerance
The AD809 exhibits a duty cycle tolerance that is measured
by applying an input signal (nominal input frequency) with a
known duty cycle imbalance and measuring the ×8 or ×16
output frequency.
Symmetry-Recovered Clock Duty Cycle
Symmetry is calculated as (100× on time)/period, where on time
equals the time that the clock signal is greater than the midpoint
between its “0” level and its “1” level.
Typical Characteristic Curves
POPULATION – Devices
RMS JITTER – Degrees
1200
1000
0
More1. 8
800
600
400
200
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4
100
90
80
70
60
50
40
30
20
10
0
CUMULATIVE – %
AD809 FREQUENCY SYNTHESIZER
JITTER DISTRIBUTION MATRIX
75 DEVICES (3 LOTS)
[ECL, TTL] × [×8, ×16] × [RISE, FALL] × [+4.5V, +5.0V, +5.5V] × [–40°C, +25°C, +85°C]
THIS CHART DESCRIBES THE
AD809 OUTPUT JITTER
SPECIFICATION OVER MANY
CONDITIONS. THE DATA
REPRESENTED ARE TAKEN
WITH RESPECT TO THE RISING
AND FALLING EDGES, FOR
EACH FREQUENCY RANGE,
LOCKED TO EITHER TTL OR
ECL INPUT, OVER ALL
TEMPERATURE AND SUPPLY
CONDITIONS.
0.0
FREQUENCY
CUMULATIVE %
Figure 2. Jitter Histogram
INPUT DUTY CYCLE – %
RMS JITTER – Degrees
1.9
1.3
1.0
0 10010 20 30 40 50 60 70 80 90
1.8
1.2
1.1
1.6
1.4
1.7
1.5
T
A
= +25°C
V
CC
= +5V
19.44MHz
9 72MHz
Figure 3. Jitter vs. Input Duty Cycle
AD809
REV. A
–5–
USING THE AD809
Ground Planes
Use of one ground plane for connections to both analog and
digital grounds is recommended.
Power Supply Connections
Use of a 10 µF capacitor between V
CC
and ground is recom-
mended. Care should be taken to isolate the +5 V power trace
to V
CC2
(Pin 3). The V
CC2
pin is used inside the device to pro-
vide the CLKOUT/CLKOUTN signals.
Use of a trace connecting Pin 14 and Pin 6 (AV
CC2
and V
CC1
respectively) is recommended. Use of 0.1 µF capacitors between
IC power supply and ground is recommended. Power supply
decoupling should take place as close to the IC as possible.
Refer to the schematic, Figure 5, for advised connections.
Transmission Lines
Use of 50 transmission lines are recommended for PECL
inputs.
Terminations
Termination resistors should be used for PECL input signals.
Metal, thick film, 1% tolerance resistors are recommended.
Termination resistors for the PECL input signals should be
placed as close as possible to the PECL input pins.
Connections from the power supply to load resistors for input
and output signals should be individual, not daisy chained. This
will avoid crosstalk on these signals.
Loop Damping Capacitor, C
D
A ceramic capacitor may be used for the loop damping capaci-
tor. A 22 nF capacitor provides a damping factor of 10.
Synthesizer Input
TTL/CMOSIN
Synthesizer Input
CLKIN/CLKINN
PECL INPUT
PLL Differential
Output Stage–
CLKOUT/CLKOUTN
2*I
TTL
80µA
OR
0µA
2*I
TTL
80µA
OR
0µA
500
V
CC1
V
EE
V
CC2
DIFFERENTIAL
OUTPUT
V
EE
2.6mA
460460
500
7.5k7.5k
I
TTL
V
CC1
V
EE
500
40µA
40µA
Figure 4. Simplified Schematics
V
EE
14
13
12
11
16
15
10
9
8
1
2
3
4
7
6
5
V
CC2
CLKOUTN
CLKOUT
CF1
CF2
MUX
CLKIN
CLKINN
AV
CC1
TTL/CMOSIN
AV
EE
GND
J5
MUX
EXT
+5V
AD809
16-PIN SOIC
SOLDERED TO BOARD
C1
0.1µF
R6
3.65k
R5
301
R2
49.9
R1
49.9
JUMPER
W2
R16
301
V
CC1
AV
CC2
GUARD RING
+5V GND
C11
10µF
TP4TP3
R7 100
R8 100
R12
154
R11
154
CD
TP1
TP2
C8
C7
C6
0.1µF
R4
100
R3
100
VECTOR PINS SPACED FOR THROUGH-HOLE
CAPACITOR ON VECTOR CUPS.
COMPONENT SHOWN FOR REFERENCE ONLY.
C5 0.1µF
J3
J4
C4 0.1µF
ECL INN
ECL IN
CLKOUTN
CLKOUT
J2
C3 0.1µF
J1
C2 0.1µF
50 STRIP LINE
EQUAL LENGTH
JUMPER
W1
JUMPER
W3
R15
49.9
R14
49.9
J6
CLKIN
J7
CLKINN
C13 0.1µF
C14 0.1µF
J8
CMOS/TTL IN
C15 0.1µF
R13
49.9
C12
0.1µF
R17
3.65k
NOTE: C7–C10 ARE 0.1µF BYPASS CAPACITORS
RIGHT ANGLE SMA CONNECTOR
OUTER SHELL TO GND PLANE
ALL RESISTORS ARE 1% 1/8 WATT SURFACE MOUNT
TPx
TEST POINTS ARE VECTOR PINS
C9
C10
PECLINN
PECLIN
Figure 5. Evaluation Board Schematic

AD809BR-REEL7

Mfr. #:
Manufacturer:
Description:
Phase Locked Loops - PLL 155MHz Freq Synthesize
Lifecycle:
New from this manufacturer.
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