RCS04022R20JNED

RCS e3
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Vishay
Revision: 19-Jul-16
7
Document Number: 20065
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Note
(1)
The quoted IEC standards are also released as EN standards with the same number and identical contents.
4.13 - Short time overload
U = 2.5 x 2 x U
max.
;
whichever is the less severe; 5 s
± (2 % R + 0.05 )
4.27 -
Single pulse
high voltage overload
Severity no. 4:
U = 10 x
or U = 2 x U
max.;
whichever is the less severe;
10 pulses 10 μs / 700 μs
± (1 % R + 0.05 )
no visible damage
4.39 - Periodic electric overload
U = or
U = 2 x U
max.;
whichever is the less severe;
0.1 s on; 2.5 s off;
1000 cycles
± (1 % R + 0.05 )
no visible damage
4.38 -
Electrostatic discharge
(human body model)
IEC 61340-3-1
(1)
;
3 positive + 3 negative discharges;
ESD voltage according to the size
± (1 % R + 0.05 )
4.22 6 (Fc) Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude 1.5 mm or 200 m/s
2
;
7.5 h
± (0.25 % R + 0.05 )
no visible damage
± (0.5 % R + 0.05 )
no visible damage
4.17 58 (Td) Solderability
Solder bath method,
SnPb40; non-activated flux
(235 ± 5) °C; (2 ± 0.2) s
Good tinning ( 95 % covered);
no visible damage
Solder bath method,
Sn96.5Ag3Cu0.5;
non-activated flux
(245 ± 5) °C; (3 ± 0.3) s
4.18 58 (Td)
Resistance to
soldering heat
Soldering bath method;
(260 ± 5) °C; (10 ± 1) s
± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
4.29 45 (XA)
Component solvent
resistance
Isopropyl alcohol +50 °C;
method 2
No visible damage
4.32 21 (Ue
3
)
Shear
(adhesion)
RCS0402 e3: 9 N
RCS0603 e3 and RCS0805 e3: 17.7 N
No visible damage
4.33 21 (Ue
1
) Substrate bending Depth 2 mm; 3 times
± (0.25 % R + 0.05 )
no visible damage,
no open circuit in bent position
4.7 - Voltage proof U = 1.4 x U
ins
; 60 s No flashover or breakdown
4.35 -
Flammability,
needle flame test
IEC 60695-11-5
(1)
;
10 s
No burning after 30 s
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60082-2
(1)
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS PERMISSIBLE
CHANGE (R)
STABILITY CLASS 1
OR BETTER
STABILITY CLASS 2
OR BETTER
Stability for product types:
1 to 10 M
RCS e3
P
70
x R
P
70
x R
15 x P
70
x R
RCS e3
www.vishay.com
Vishay
Revision: 19-Jul-16
8
Document Number: 20065
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
DIMENSIONS
SOLDER PAD DIMENSIONS
Notes
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g in standards IEC 61188-5-x
(1)
or
in publication IPC-7351.
(1)
The quoted IEC standards are also released as EN standards with the same number and identical contents.
DIMENSIONS AND MASS
TYPE / SIZE
L
(mm)
W
(mm)
H
(mm)
T1
(mm)
T2
(mm)
MASS
(mg)
RCS0402 e3 1.0 ± 0.05 0.5 ± 0.05 0.35 ± 0.05 0.25 ± 0.05 0.2 ± 0.10 0.65
RCS0603 e3 1.55 + 0.10 / - 0.05 0.85 ± 0.10 0.45 ± 0.05 0.3 ± 0.20 0.3 ± 0.20 2
RCS0805 e3 2.0 + 0.20 / - 0.10 1.25 ± 0.15 0.45 ± 0.05 0.3 + 0.20 / - 0.10 0.3 ± 0.20 5.5
RCS1206 e3 3.2 + 0.10 / - 0.20 1.6 ± 0.15 0.55 ± 0.10 0.45 ± 0.20 0.4 ± 0.20 10
RECOMMENDED SOLDER PAD DIMENSIONS
TYPE / SIZE
WAVE SOLDERING REFLOW SOLDERING
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
RCS0402 e3 - - - - 0.45 0.6 0.6 1.65
RCS0603 e3 0.65 1.10 1.25 2.85 0.75 0.75 1.00 2.15
RCS0805 e3 0.90 1.30 1.60 3.50 1.00 0.95 1.45 2.90
RCS1206 e3 1.40 1.40 1.95 4.20 1.50 1.05 1.80 3.60
G
X
Y
Z
Legal Disclaimer Notice
www.vishay.com
Vishay
Revision: 13-Jun-16
1
Document Number: 91000
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RCS04022R20JNED

Mfr. #:
Manufacturer:
Vishay / Dale
Description:
Res Thick Film 0402 2.2 Ohm 5% 0.2W(1/5W) ±200ppm/C Pad SMD Automotive T/R
Lifecycle:
New from this manufacturer.
Delivery:
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