6.42
10
IDT71V67602, IDT71V67802, 256K x 36, 512K x 18, 3.3V Synchronous Commercial and Industrial Temperature Ranges
SRAMs with 2.5V I/O, Pipelined Outputs, Single Cycle Deselect
Synchronous Truth Table
(1,3)
NOTES:
1. L = VIL, H = VIH, X = Don’t Care.
2. OE is an asynchronous input.
3. ZZ = low for this table.
Operation Address
Used
CE
CS
0
CS
1
ADSP ADSC ADV GW BWE BWx OE
(2)
CLK I/O
Deselected Cycle, Power Down NoneHXXX L XXXXX-HI-Z
Deselected Cycle, Power Down NoneLXHL XXXXXX-HI-Z
Deselected Cycle, Power Down NoneLLX L XXXXXX-HI-Z
Deselected Cycle, Power Down NoneLXHX L XXXXX -HI-Z
Deselected Cycle, Power Down NoneLLX X L XXXXX-HI-Z
Read Cycle, Begin Burst ExternalLHL L X XXXXL -D
OUT
Read Cycle, Begin Burst ExternalLHL L X XXXXH-HI-Z
Read Cycle, Begin Burst External L H L H L X H H X L - D
OUT
Read Cycle, Begin Burst External L H L H L X H L H L - D
OUT
Read Cycle, Begin Burst External L H L H L X H L H H - HI-Z
Write Cycle, Begin Burst External L H L H L X H L L X - D
IN
Write Cycle, Begin Burst External L H L H L X L X X X - D
IN
Read Cycle, Continue Burst Next X X X H H L H H X L - D
OUT
Read Cycle, Continue Burst Next X X X H H L H H X H - HI-Z
Read Cycle, Continue Burst Next X X X H H L H X H L - D
OUT
Read Cycle, Continue Burst Next X X X H H L H X H H - HI-Z
Read Cycle, Continue Burst Next H X X X H L H H X L - D
OUT
Read Cycle, Continue Burst Next H X X X H L H H X H - HI-Z
Read Cycle, Continue Burst Next H X X X H L H X H L - D
OUT
Read Cycle, Continue Burst Next H X X X H L H X H H - HI-Z
Write Cycle, Continue Burst Next X X X H H L H L L X - D
IN
Write Cycle, Continue Burst NextXXX H HLLXXX-D
IN
Write Cycle, Continue Burst Next H X X X H L H L L X - D
IN
Write Cycle, Continue Burst Next H X X X H L L X X X - D
IN
Read Cycle, Suspend Burst Current X X X H H H H H X L - D
OUT
Read Cycle, Suspend Burst Current X X X H H H H H X H - HI-Z
Read Cycle, Suspend Burst Current X X X H H H H X H L - D
OUT
Read Cycle, Suspend Burst Current X X X H H H H X H H - HI-Z
Read Cycle, Suspend Burst Current H X X X H H H H X L - D
OUT
Read Cycle, Suspend Burst Current H X X X H H H H X H - HI-Z
Read Cycle, Suspend Burst Current H X X X H H H X H L - D
OUT
Read Cycle, Suspend Burst Current H X X X H H H X H H - HI-Z
Write Cycle, Suspend Burst Current X X X H H H H L L X - D
IN
Write Cycle, Suspend Burst Current X X X H H H L X X X - D
IN
Write Cycle, Suspend Burst Current H X X X H H H L L X - D
IN
Write Cycle, Suspend Burst Current H X X X H H L X X X - D
IN
5311 tbl 11
6.42
11
IDT71V67602, IDT71V67802, 256K x 36, 512K x 18, 3.3V Synchronous Commercial and Industrial Temperature Ranges
SRAMs with 2.5V I/O, Pipelined Outputs, Single Cycle Deselect
Linear Burst Sequence Table (LBO=VSS)
Synchronous Write Function Truth Table
(1, 2)
Asynchronous Truth Table
(1)
Interleaved Burst Sequence Table (LBO=VDD)
NOTES:
1. L = V
IL, H = VIH, X = Don’t Care.
2. BW
3 and BW4 are not applicable for the IDT71V67802.
3. Multiple bytes may be selected during the same cycle.
NOTES:
1. L = VIL, H = VIH, X = Don’t Care.
2. Synchronous function pins must be biased appropriately to satisfy operation requirements.
NOTE:
1. Upon completion of the Burst sequence the counter wraps around to its initial state.
NOTE:
1. Upon completion of the Burst sequence the counter wraps around to its initial state.
Operation
GW BWE BW
1
BW
2
BW
3
BW
4
Read HHXXXX
Read HLHHHH
Write all BytesLXXXXX
Write all BytesHLLLLL
Write Byte 1
(3)
HLLHHH
Write Byte 2
(3)
HLHLHH
Write Byte 3
(3)
HLHHLH
Write Byte 4
(3)
HLHHHL
5311 tbl 12
Sequence 1 Sequence 2 Sequence 3 Sequence 4
A1 A0 A1 A0 A1 A0 A1 A0
First Address 0 0 0 1 1 0 1 1
Second Address 0 1 1 0 1 1 0 0
Third Address 1 0 1 1 0 0 0 1
Fourth Address
(1 )
11000110
5311 tbl 15
Sequence 1 Sequence 2 Sequence 3 Sequence 4
A1 A0 A1 A0 A1 A0 A1 A0
First Address 0 0 0 1 1 0 1 1
Second Address 01001110
Third Address 1 0 1 1 0 0 0 1
Fourth Address
(1 )
11100100
5311 tbl 14
Operation
(2)
OE
ZZ I/O Status Power
Read L L Data Out Active
Read H L High-Z Active
Write X L High-Z – Data In Active
Deselected X L High-Z Standby
Sleep Mode X H High-Z Sleep
5311 tbl 13
6.42
12
IDT71V67602, IDT71V67802, 256K x 36, 512K x 18, 3.3V Synchronous Commercial and Industrial Temperature Ranges
SRAMs with 2.5V I/O, Pipelined Outputs, Single Cycle Deselect
AC Electrical Characteristics
(VDD = 3.3V ±5%, Commercial and Industrial Temperature Ranges)
NOTES:
1. Measured as HIGH above VIH and LOW below VIL.
2. Transition is measured ±200mV from steady-state.
3. Device must be deselected when powered-up from sleep mode.
4. tCFG is the minimum time required to configure the device based on the LBO input. LBO is a static input and must not change during normal operation.
166MHz 150MHz 133MHz
Symbol Parameter Min. Max. Min. Max. Min. Max. Unit
t
CY C
Clock Cycle Time 6
____
6.7
____
7.5
____
ns
t
CH
(1 )
Clock High Pulse Width 2.4
____
2.6
____
3
____
ns
t
CL
(1)
Clock Low Pulse Width 2.4
____
2.6
____
3
____
ns
Output Parameters
t
CD
Clock High to Valid Data
____
3.5
____
3.8
____
4.2 ns
t
CDC
Clock High to Data Change 1.5
____
1.5
____
1.5
____
ns
t
CL Z
(2)
Clock High to Output Active 0
____
0
____
0
____
ns
t
CHZ
(2)
Clock High to Data High-Z 1.5 3.5 1.5 3.8 1.5 4.2 ns
t
OE
Output Enable Access Time
____
3.5
____
3.8
____
4.2 ns
t
OLZ
(2 )
Output Enable Low to Output Active 0
____
0
____
0
____
ns
t
OHZ
(2 )
Output Enable High to Output High-Z
____
3.5
____
3.8
____
4.2 ns
Set Up Times
t
SA
Address Setup Time 1.5
____
1.5
____
1.5
____
ns
t
SS
Address Status Setup Time 1.5
____
1.5
____
1.5
____
ns
t
SD
Data In Setup Time 1.5
____
1.5
____
1.5
____
ns
t
SW
Write Setup Time 1.5
____
1.5
____
1.5
____
ns
t
SAV
Address Advance Setup Time 1.5
____
1.5
____
1.5
____
ns
t
SC
Chip Enable/Select Setup Time 1.5
____
1.5
____
1.5
____
ns
Hold Times
t
HA
Address Hold Time 0.5
____
0.5
____
0.5
____
ns
t
HS
Address Status Hold Time 0.5
____
0.5
____
0.5
____
ns
t
HD
Data In Hold Time 0.5
____
0.5
____
0.5
____
ns
t
HW
Write Hold Time 0.5
____
0.5
____
0.5
____
ns
t
HAV
Address Advance Hold Time 0.5
____
0.5
____
0.5
____
ns
t
HC
Chip Enable/Select Hold Time 0.5
____
0.5
____
0.5
____
ns
Sleep Mode and Configuration Parameters
t
ZZP W
ZZ Pulse Width 100
____
100
____
100
____
ns
t
ZZR
(3)
ZZ Recovery Time 100
____
100
____
100
____
ns
t
CFG
(4)
Configuration Set-up Time 24
____
27
____
30
____
ns
5311 tbl 16

IDT71V67802S133PF

Mfr. #:
Manufacturer:
Description:
IC SRAM 9M PARALLEL 100TQFP
Lifecycle:
New from this manufacturer.
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