HSMB-C172

4
Device Selection Guide
Package Dimension (mm) GaN Blue Package Description
1.6 (L) x 0.8 (W) x 0.6 (H) HSMB-C196 Untinted, Diffused
1.6 (L) x 0.8 (W) x 0.8 (H) HSMB-C192 Untinted, Diffused
2.0 (L) x 1.25 (W) x 0.8 (H) HSMB-C172 Untinted, Diffused
3.2 (L) x 1.5 (W) x 1.0 (H)
[1]
HSMB-C112 Untinted, Nondiffused
3.2 (L) x 1.6 (W) x 1.1 (H) HSMB-C152 Untinted, Diffused
Note:
1. Right angle package.
Electrical Characteristics at T
A
= 25˚C
Forward Reverse
Voltage Breakdown Capacitance C Thermal
V
F
(Volts) V
R
(Volts) (pF), V
F
= 0, Resistance
@ I
F
= 10 mA @ I
R
= 100 µAf = 1 MHz Rθ
J-PIN
(˚C/W)
Part Number Typ. Max. Min. Typ. Typ.
HSMB-C152/C172/C192/C196 4.0 4.6 5 43 550
HSMB-C112 4.0 4.6 5 43 550
Absolute Maximum Ratings at T
A
= 25˚C
Parameter HSMB-C112/172/192/196/152 Units
DC Forward Current
[1]
10 mA
Power Dissipation 46 mW
Reverse Voltage (I
R
= 100 µA) 5 V
LED Junction Temperature 95 ˚C
Operating Temperature Range –30 to +85 ˚C
Storage Temperature Range –40 to +85 ˚C
Soldering Temperature See reflow soldering profile (Figure 7 & 8)
Note:
1. Derate linearly as shown in Figure 4.
Optical Characteristics at T
A
= 25˚C
Luminous Color
Intensity Peak Dominant Luminous
I
v
(mcd) Wavelength Wavelength Viewing Angle Efficacy
@ 10 mA
[1]
λ
peak
(nm) λ
d
[2]
(nm) 2 θ
1/2
Degrees
[3]
η
v
(lm/w)
Part Number Min. Typ. Typ. Typ. Typ. Typ.
HSMB-C112 1.1 3.1 428 462 130 55
HSMB-C172 1.1 3.0 428 462 170 55
HSMB-C192 1.1 3.0 428 462 170 55
HSMB-C196 1.1 3.0 428 462 170 55
HSMB-C152 1.1 3.0 428 462 170 55
Notes:
1.The luminous intensity I
v
is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp
package.
2.The dominant wavelength λ
d
is derived from the CIE Chromatically Diagram and represents the perceived color of the device.
3.θ
1/2
is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
V
F
Tolerance: ± 0.1 V
5
Blue Color Bin Limits
[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 460 465
B 465 470
C 470 475
D 475 480
Light Intensity (I
v
) Bin Limits
[1]
Intensity (mcd)
Bin ID Min. Max.
A0.110.18
B0.180.29
C0.290.45
D0.450.72
E0.721.10
F1.101.80
G1.802.80
H2.804.50
J4.507.20
K7.2011.20
L11.20 18.00
M18.00 28.50
N28.50 45.00
P45.00 71.50
Q71.50 112.50
R 112.50 180.00
S 180.00 285.00
T 285.00 450.00
U 450.00 715.00
V 715.00 1125.00
W 1125.00 1800.00
X 1800.00 2850.00
Y 2850.00 4500.00
Figure 1. Relative intensity vs. wavelength.
Figure 2. Forward current vs. forward voltage.
Figure 3. Luminous intensity vs. forward
current.
Figure 4. Maximum forward current vs.
ambient temperature.
Figure 5. Relative intensity vs. angle for HSMx-C172, C192, C196, and C152.
400
100
0
600 700
20
RELATIVE INTENSITY – %
WAVELENGTH – nm
500
60
40
80
450 550 650
100
10
1
0.1
3.0 3.2 3.6 3.8 4.2
V
F
– FORWARD VOLTAGE – V
I
F
– FORWARD CURRENT – mA
3.4 4.0
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
50
70
20
10
30
40
90
-70 -50
-30 0 20 30 507090-90 -20-80 -60 -40 -10 10 40 60 80
05 15
I
F
– FORWARD CURRENT – mA
0
40
100
120
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
20
60
20
80
10
Tolerance: ± 15%
Notes:
1. Bin categories are established for
classification of products. Products may
not be available in all categories. Please
contact your Avago srepresentative for
information regarding currently available
bins.
2. The Iv binning specification set-up is for
lowest allowable Iv binning only. There are
no upper Iv bin limits.
0
12
0
20 60 80 100
2
I
F MAX.
– MAXIMUM FORWARD CURRENT – mA
T
A
– AMBIENT TEMPERATURE – °C
40
8
6
10
4
10 30 50 70 90
Tolerance: ±1 nm
6
Figure 6. Relative intensity vs. angle for HSMx-C112.
Figure 8. Recommended Pb-free reflow soldering profile.
Figure 9. Recommended soldering pattern for HSMx-C112.
Figure 10. Recommended soldering pattern for HSMx-C172.
Figure 11. Recommended soldering pattern for HSMx-C192
and HSMx-C196.
Figure 12. Recommended soldering pattern for HSMx-C152.
RELATIVE INTENSITY – %
100
0
ANGLE
40
20
60
80
020 100-100 -20-80 -60 -40 40 60 80
RELATIVE INTENSITY – %
100
0
ANGLE
40
20
60
80
020 100-100 -20-80 -60 -40 40 60 80
5.0 (0.200)
1.0 (0.039)
1.5
(0.059)
1.5
(0.059)
2.0
(0.079)
0.9 (0.035)
0.2 (0.008)
0.9 (0.035)
CENTERING
BOARD
1.2 (0.047)
1.2
(0.047)
0.9
(0.035)
1.2
(0.047)
0.8 (0.031)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
1.5 (0.059)
1.5
(0.059)
1.5
(0.059)
2.0
(0.079)
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
Figure 7. Recommended reflow soldering profile.
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
TEMPERATURE
4°C/SEC. MAX.
140-160°C
–3°C/SEC.
217 °C
200 °C
60 - 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
3 °C/SEC. MAX.
150 °C
255 - 260 °C
100 SEC. MAX.
(Acc. to J-STD-020C)
10 - 30 SEC.
TIME
TEMPERATURE

HSMB-C172

Mfr. #:
Manufacturer:
Broadcom / Avago
Description:
Standard LEDs - SMD Blue aN Blue
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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