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KSZ9893RNXC

P1-P3P4-P6P7-P9P10-P11
2016 Microchip Technology Inc. DS00002318A-page 4
KSZ9893RNX
2.0 PACKAGE INFORMATION
2.1 Package Drawings
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
FIGURE 2-1: PACKAGE (DRAWING)
B
A
0.10
C
0.10
C
0.07 C A B
0.05 C
(DATUM B)
(DATUM A)
NOTE 1
1
2
N
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 1
1
2
N
0.10 C A B
0.10 C A B
Microchip Technology Drawing C04-437A Sheet 1 of 2
D
E
64X b
e
e
2
2X
D2
E2
K
L
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
64-Lead Very Thin Plastic Quad Flat, No Lead Package (JXX) - 8x8 mm Body [VQFN]
C
SEATING
PLANE
0.10
C
0.08
C
A
64X
SEE
DETAIL A
KSZ9893RNX
DS00002318A-page 5 2016 Microchip Technology Inc.
FIGURE 2-2: PACKAGE (DIMENSIONS)
Microchip Technology Drawing C04-437A Sheet 2 of 2
Number of Terminals
Overall Height
Terminal Width
Overall Width
Terminal Length
Exposed Pad Width
Terminal Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
E2
A3
e
L
E
N
0.40 BSC
0.20 REF
6.40
0.35
0.15
0.80
0.00
0.20
0.40
6.50
0.85
0.02
8.00 BSC
MILLIMETERS
MIN
NOM
64
6.60
0.45
0.25
0.90
0.05
MAX
K-0.25 -
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
Terminal-to-Exposed-Pad
64-Lead Very Thin Plastic Quad Flat, No Lead Package (JXX) - 8x8 mm Body [VQFN]
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Overall Length
Exposed Pad Length
D
D2 6.40
8.00 BSC
6.50 6.60
C
SEATING
PLANE
(A3)
A1
A
DETAIL A
2016 Microchip Technology Inc. DS00002318A-page 6
KSZ9893RNX
FIGURE 2-3: PACKAGE (LAND PATTERN)
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
6.60
6.60
MILLIMETERS
0.40 BSC
MIN
E
MAX
7.90
Contact Pad Length (X64)
Contact Pad Width (X64)
Y1
X1
0.80
0.20
Microchip Technology Drawing C04-2437A
NOM
64-Lead Very Thin Plastic Quad Flat, No Lead Package (JXX) - 8x8 mm Body [VQFN]
SILK SCREEN
1
2
64
C1
C2
E
X1
Y1
G1
Y2
X2
C1Contact Pad Spacing 7.90
Contact Pad to Center Pad (X64) G1 0.20
Thermal Via Diameter V
Thermal Via Pitch EV
0.33
1.20
ØV
EV
EV
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
P1-P3P4-P6P7-P9P10-P11

KSZ9893RNXC

Mfr. #:
Buy KSZ9893RNXC
Manufacturer:
Microchip Technology
Description:
Ethernet ICs 3-Port Gigabit Ethernet Switch with EEE, WOL, QoS, LinkMD
Lifecycle:
New from this manufacturer.
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