Tflex
TM
CR200 Series
Gap Filler Material
Americas: +1.800.843.4556
Europe: +49.8031.2460.0
Asia: +86.755.2741.1166
CLV-customerservice@lairdtech.com
www.lairdtech.com/thermal
TWO-PART CURE IN PLACE GAP FILLER
Tflex™ CR200 is a two-part, silicone-based thermal gap filler that has low viscosity prior to
curing. Tflex™ CR200 is ideal for applications where large gap tolerances are present. The low
viscosity makes it ideal for applications in which the components cannot withstand high
pressure during assembly. The mixed material will cure at room temperature or can be
accelerated with the addition of heat. The Tflex™ CR200 composition provides excellent
thermal performance and compliance.
Soft and compliant transferring little to
no pressure between interfaces
2.0 W/mK thermal conductivity
Available in 50cc & 200cc cartridges, and
20 kg pail kits
Easy to dispense
Automotive electronics
LED Lighting
Graphic chips
Telecom Base Stations
Microprocessors
Two-part, ceramic filled
dispensable liquid
silicone gap filler
Viscosity before combining (cps)
Thermal Conductivity (W/mK)
Hardness (Shore 00): 3 seconds
Volume Resistivity (Ohm-cm)
Continuous Use Temperature (°C)
Minimum Bondline Thickness
(microns)
Glass Transition Temperture, Tg (°C)
< -60
Pot life @ 25°C (minutes)
≥ 60
OPTIONS
Available in 50 cc & 200 cc cartridges, and 20 kg pail kits
Available with or without beads (8 mils and 10 mils beads)
THR-DS-Tflex CR200_040617
Any information furnished by Laird and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use
and application of Laird materials rests with the end user, since Laird and its agents cannot be aware of all potential uses. Laird makes no warranties as to the fitness,
merchantability or suitability of any Laird materials or products for any specific or general uses. Laird, Laird Technologies, Inc or any of its affiliates or agents shall not be
liable for incidental or consequential damages of any kind. All Laird products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time
to time, a copy of which will be furnished upon request. © Copyright 2015 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Logo, and other
marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third
parties. Nothing herein provides a license under any Laird or any third party intellectual property rights.
