OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

IRLI530NPBF

P1-P3P4-P6P7-P9
IRLI530NPbF
V
DSS
100V
R
DS(on)
0.10
I
D
12A
Description
Fifth Generation HEXFETs from International Rectifier utilize
advanced processing techniques to achieve extremely low on-
resistance per silicon area. This benefit, combined with the fast
switching speed and ruggedized device design that HEXFET
Power MOSFETs are well known for, provides the designer with
an extremely efficient and reliable device for use in a wide variety
of applications.
The TO-220 Fullpak eliminates the need for additional insulating
hardware in commercial-industrial applications. The moulding
compound used provides a high isolation capability and a low
thermal resistance between the tab and external heatsink. This
isolation is equivalent to using a 100 micron mica barrier with
standard TO-220 product. The Fullpak is mounted to a heatsink
using a single clip or by a single screw fixing.
1 2017-04-27
Absolute Maximum Ratings
Symbol Parameter Max. Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V 12
A
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10V 8.6
I
DM
Pulsed Drain Current  60
P
D
@T
C
= 25°C Maximum Power Dissipation 41 W
Linear Derating Factor
0.27
W/°C
V
GS
Gate-to-Source Voltage
± 16
V
E
AS
Single Pulse Avalanche Energy (Thermally Limited)  150
mJ
I
AR
Avalanche Current  9.0 A
E
AR
Repetitive Avalanche Energy 4.1 mJ
dv/dt Peak Diode Recovery dv/dt 5.0 V/ns
T
J
Operating Junction and -55 to + 175
T
STG
Storage Temperature Range
°C
Soldering Temperature, for 10 seconds (1.6mm from case) 300
Mounting torque, 6-32 or M3 screw 10 lbf•in (1.1N•m)
G D S
Gate Drain Source
Logic –Level Gate Drive
Advanced Process Technology
Isolated Package
High Voltage Isolation = 2.5KVRMS
Sink to Lead Creepage Dist. = 4.8mm
Fully Avalanche Rated
Lead-Free
HEXFET
®
Power MOSFET
TO-220 Full-Pak
Base Part Number Package Type
Standard Pack
Orderable Part Number
Form Quantity
IRLI530NPbF
TO-220 Full-Pak Tube 50 IRLI530NPbF
Thermal Resistance
Symbol Parameter Typ. Max. Units
R
JC
Junction-to-Case ––– 3.7
R
JA
Junction-to-Ambient ––– 65
°C/W
G
D
S
IRLI530NPbF
2 2017-04-27
Notes:
Repetitive rating; pulse width limited by max. junction temperature. (See fig. 11)
Starting T
J
= 25°C, L = 3.1mH, R
G
= 25, I
AS
= 9.0A (See fig. 12)
I
SD
9.0A, di/dt 540A/µs, V
DD
V
(BR)DSS
, T
J
175°C.
Pulse width 300µs; duty cycle 2%.
t=60s, ƒ=60Hz
Uses IRL530N data and test conditions.
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage 100 ––– ––– V V
GS
= 0V, I
D
= 250µA
V
(BR)DSS
/T
J
Breakdown Voltage Temp. Coefficient ––– 0.122 ––– V/°C Reference to 25°C, I
D
= 1mA
R
DS(on)
Static Drain-to-Source On-Resistance
––– ––– 0.100

V
GS
= 10V, I
D
= 9.0A
––– ––– 0.120 V
GS
= 5.0V, I
D
= 9.0A
––– ––– 0.150 V
GS
= 4.0V, I
D
= 8.0A
V
GS(th)
Gate Threshold Voltage 1.0 ––– 2.0 V V
DS
= V
GS
, I
D
= 250µA
gfs Forward Trans conductance 7.7 ––– ––– S V
DS
= 50V, I
D
= 9.0A
I
DSS
Drain-to-Source Leakage Current
––– ––– 25
µA
V
DS
= 100V, V
GS
= 0V
––– ––– 250 V
DS
= 80V,V
GS
= 0V,T
J
=150°C
I
GSS
Gate-to-Source Forward Leakage ––– ––– 100
nA
V
GS
= 16V
Gate-to-Source Reverse Leakage ––– ––– -100 V
GS
= -16V
Q
g
Total Gate Charge ––– ––– 34
nC
I
D
= 9.0A
Q
gs
Gate-to-Source Charge ––– ––– 4.8 V
DS
= 80V
Q
gd
Gate-to-Drain Charge ––– ––– 20
V
GS
= 5.0V , See Fig. 6 and 13
t
d(on)
Turn-On Delay Time ––– 7.2 –––
ns
V
DD
= 50V
t
r
Rise Time ––– 53 –––
I
D
= 9.0A
t
d(off)
Turn-Off Delay Time ––– 30 –––
R
G
= 6.0V
GS
= 5.0V
t
f
Fall Time ––– 26 –––
R
D
= 5.5See Fig. 10
L
D
Internal Drain Inductance ––– 4.5 –––
nH
Between lead,
6mm (0.25in.)
L
S
Internal Source Inductance ––– 7.5 –––
from package
and center of die contact
C
iss
Input Capacitance ––– 800 –––
pF
V
GS
= 0V
C
oss
Output Capacitance ––– 160 ––– V
DS
= 25V
C
rss
Reverse Transfer Capacitance ––– 90 –––
ƒ = 1.0MHz, See Fig. 5
C
Drain to Sink Capacitance ––– 12 ––– ƒ = 1.0MHz
Source-Drain Ratings and Characteristics
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current
––– ––– 12
A
MOSFET symbol
(Body Diode)
showing the
I
SM
Pulsed Source Current
––– ––– 60
integral reverse
(Body Diode) p-n junction diode.
V
SD
Diode Forward Voltage ––– ––– 1.3 V T
J
= 25°C,I
S
= 6.6A,V
GS
= 0V 
t
rr
Reverse Recovery Time ––– 140 210 ns
T
J
= 25°C ,I
F
= 9.0A
Q
rr
Reverse Recovery Charge ––– 740 1100 nC
di/dt = 100A/µs 
t
on
Forward Turn-On Time
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
IRLI530NPbF
3 2017-04-27
Fig. 2 Typical Output Characteristics
Fig. 3 Typical Transfer Characteristics
Fig. 4 Normalized On-Resistance
vs. Temperature
Fig. 1 Typical Output Characteristics
0.1
1
10
100
0.1 1 10 100
I , Drain-to-Source Current (A)
D
V , Drain-to-Source Voltage (V)
DS
A
20µs PULSE WIDTH
T = 25°C
J
VGS
TOP 15V
12V
10V
8.0V
6.0V
4.0V
3.0V
BOTTOM 2.5V
2.5V
0.1
1
10
100
0.1 1 10 100
I , Drain-to-Source Current (A)
D
V , Drain-to-Source Voltage (V)
DS
A
20µs PULSE WIDTH
T = 175°C
VGS
TOP 15V
12V
10V
8.0V
6.0V
4.0V
3.0V
BOTTOM 2.5V
2.5V
J
0.1
1
10
100
2345678910
T = 25°C
J
GS
V , Gate-to-Source Voltage (V)
D
I , Drain-to-Source Current (A)
V = 50V
20µs PULSE WIDTH
T = 175°C
J
A
DS
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
J
T , Junction Temperature (°C)
R , Drain-to-Source On Resistance
DS(on)
(Normalized)
V = 10V
GS
A
I = 15A
D
P1-P3P4-P6P7-P9

IRLI530NPBF

Mfr. #:
Buy IRLI530NPBF
Manufacturer:
Infineon Technologies
Description:
MOSFET MOSFT 100V 11A 100mOhm 22.7nC LogLv
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet