Spec No. JELF243B-0041F-01 P3/8
MURATA MFG.CO., LTD
Reference
Only
No. Item Specification Test Method
7.4 Drop Chip coil shall not be damaged after
tested as follows.
It shall be dropped on concrete or steel
board.
Method : free fall
Height : 1m
Total of 10 cycles
7.5 Solderability The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 60s to 90s
Solder Temperature: 240°C±5°C
Immersion Time: 3s±1s
7.6 Resistance to
Soldering Heat
Appearance: No damage
Inductance Change: within ±30%
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 60s to 90s
Solder Temperature: 270°C±5°C
Immersion Time: 10s±1s
Then measured after exposure in the room
condition for 24h±2h.
8. Environmental Performance
It shall be soldered on the substrate.
No. Item Specification Test Method
8.1 Heat Resistance Appearance: No damage
Inductance Change: within ±30%
Temperature: 85°C±2°C
Time: 1000h (+48h,-0h)
Then measured after exposure in the room
condition for 24h±2h.
8.2 Cold Resistance Temperature: -40°C±2°C
Time: 1000h (+48h,-0h)
Then measured after exposure in the room
condition for 24h±2h.
8.3 Humidity Temperature: 40°C±2°C
Humidity: 90%(RH) to 95%(RH)
Time: 1000h (+48h,-0h)
Then measured after exposure in the room
condition for 24h±2h.
8.4 Temperature
Cycle
1 cycle:
1 step: -40°C±2°C / 30 min±3 min
2 step: Ordinary temp. / 10 min to 15 min
3 step: 85°C±2°C / 30 min to 3 min
4 step: Ordinary temp. / 10 min to15 min
Total of 100cycles
Then measured after exposure in the room
condition for 24h±2h.