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VND830SP
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P27
VND830SP
Application information
D
oc ID 7380
Rev 5
19/27
3.5
Maximum demagnetization energy (V
CC
= 13.5V)
Figure 26.
Maximum turn-off current
versus load induct
ance
Note:
V
a
lues are generated with
R
L
= 0
Ω.
In case of repetitiv
e pulses
, T
jstar
t
(at beginning of each demag
netization) of e
v
ery
pulse
must not
exceed
the temperatur
e specified abov
e f
or curves B and C
.
1
10
100
0,
1
1
10
100
L(
m
H
)
I
LM
A
X
(
A
)
V
IN
, I
L
t
Demagnetiz
ation
Demagnetizatio
n
Demagnetizatio
n
A = single pulse at T
Jstart
= 150ºC
B= repetitive pulse at T
Jstart
= 100ºC
C= repetitive p
ulse at T
Jstart
= 125ºC
A
B
C
Obsolete Product(s) - Obsolete Product(s)
Package and PCB therma
l data
VND830SP
20/27
D
oc ID 7380
Rev 5
4
Package and PCB thermal dat
a
4.1 PowerSO-10
thermal
dat
a
Figure 27.
PowerSO-10 PC board
Note:
La
yout condition of R
th
and Z
th
measurements (PCB FR4 area = 58 mm x 58 mm, PCB
thickne
ss = 2 mm, Cu thickness = 35 µm, Co
pper areas: from minim
um pad la
y-out to
8cm
2
).
Figure 28.
R
thj-amb
vs PCB copper area in open box free
air condition
30
35
40
45
50
55
024
6
8
1
0
PCB Cu hea
tsink area (cm^2)
RTHj_amb (°C/W)
Tj-T
amb=50°C
Obsolete Product(s) - Obsolete Product(s)
VND830SP
Packag
e and PCB thermal data
D
oc ID 7380
Rev 5
21/27
Figure 29.
Thermal impeda
nce junction ambient s
ingle pulse
Equation 1
:
pulse calculation f
ormula
Figure 30.
Thermal fitting model of a double
channel HSD in PowerSO-10
Z
TH
δ
R
TH
δ
Z
THtp
1
δ
–
()
+
⋅
=
where
δ
t
p
T
⁄
=
T_amb
Pd1
C1
R4
C3
C4
R3
R1
R6
R5
R2
C5
C6
C2
Pd2
R2
C1
C2
R1
Tj_1
Tj_2
Obsolete Product(s) - Obsolete Product(s)
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P27
VND830SP
Mfr. #:
Buy VND830SP
Manufacturer:
STMicroelectronics
Description:
IC DRIVER DUAL 36V 6A POWERSO-10
Lifecycle:
New from this manufacturer.
Delivery:
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