TransferJet™-Compliant Wireless Module: TJM35420XLQ
To address the needs of the rapidly growing market for proximity wireless applications, Toshiba has developed an
ultra-small TransferJet™ SDIO module. The smallest possible components are required for space-critical mobile
devices such as smartphones. The ultra-small TransferJet™ SDIO module, which embodies Toshiba's radio-
frequency (RF) design and hybrid integration technologies, helps save board space. The TJM35420XLQ module
contains RF components and a crystal oscillator to simplify the design of TransferJet™ applications.
Applications
Electronic devices such as smartphones, tablets, digital cameras and notebook PCs
Key Features
Package: LGA
Incorporates the TC35420, a TransferJet™-compliant wireless IC
Built-in RF components
Built-in X'tal
Host interface: SDIO UHS-I support
TransferJet™-compliant
Outline dimensions: 4.8 (W) × 4.8 (D) × 1.0 (H) (max) (Unit: mm)
