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74LVT244ABQ-Q100X

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16
74LVT_LVTH244A_Q100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 22 April 2013 9 of 15
NXP Semiconductors
74LVT244A-Q100; 74LVTH244A-Q100
3.3 V octal buffer/line driver; 3-state
12. Package outline
Fig 8. Package outline SOT163-1 (SO20)
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(1) (1)
eH
E
LL
p
Q
Z
ywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
inches
2.65
0.3
0.1
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.1
0.4
SOT163-1
10
20
w M
b
p
detail X
Z
e
11
1
D
y
0.25
075E04 MS-013
pin 1 index
0.1
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.51
0.49
0.30
0.29
0.05
1.4
0.055
0.419
0.394
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
0 5 10 mm
scale
X
θ
A
A
1
A
2
H
E
L
p
Q
E
c
L
v M
A
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
99-12-27
03-02-19
74LVT_LVTH244A_Q100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 22 April 2013 10 of 15
NXP Semiconductors
74LVT244A-Q100; 74LVTH244A-Q100
3.3 V octal buffer/line driver; 3-state
Fig 9. Package outline SOT360-1 (TSSOP20)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.5
0.2
8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT360-1 MO-153
99-12-27
03-02-19
w M
b
p
D
Z
e
0.25
110
20
11
pin 1 index
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v M
A
X
A
y
0 2.5 5 mm
scale
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
A
max.
1.1
74LVT_LVTH244A_Q100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 22 April 2013 11 of 15
NXP Semiconductors
74LVT244A-Q100; 74LVTH244A-Q100
3.3 V octal buffer/line driver; 3-state
Fig 10. Package outline SOT764-1 (DHVQFN20)
terminal 1
index area
0.51
A
1
E
h
b
UNIT
ye
0.2
c
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
4.6
4.4
D
h
3.15
2.85
y
1
2.6
2.4
1.15
0.85
e
1
3.5
0.30
0.18
0.05
0.00
0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT764-1 MO-241 - - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT764-1
DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
20 terminals; body 2.5 x 4.5 x 0.85 mm
A
(1)
max.
A
A
1
c
detail X
y
y
1
C
e
L
E
h
D
h
e
e
1
b
29
19
12
11
10
1
20
X
D
E
C
B
A
terminal 1
index area
AC
C
B
v
M
w
M
E
(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D
(1)
02-10-17
03-01-27
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16

74LVT244ABQ-Q100X

Mfr. #:
Buy 74LVT244ABQ-Q100X
Manufacturer:
Nexperia
Description:
Buffers & Line Drivers 3.3 V octal buffer/ line driver
Lifecycle:
New from this manufacturer.
Delivery:
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