13
LT1521/LT1521-3
LT1521-3.3/LT1521-5
1521335fb
APPLICATIONS INFORMATION
WUU
U
Table 4. Fault Conditions
INPUT PIN SHDN PIN OUTPUT/SENSE PINS RESULTING CONDITIONS
< V
OUT
(Nominal) Open (High) Forced to V
OUT
(Nominal) Reverse Output Current ≈ 5µA (See Figure 3)
Input Current ≈ 1µA (See Figure 4)
< V
OUT
(Nominal) Grounded Forced to V
OUT
(Nominal) Reverse Output Current ≈ 5µA (See Figure 3)
Input Current ≈ 1µA (See Figure 4)
Open Open (High) > 1V Reverse Output Current ≈ 5µA (See Figure 3)
Open Grounded > 1V Reverse Output Current ≈ 5µA (See Figure 3)
≤ 0.8V Open (High) ≤ 0V Output Current = 0
≤ 0.8V Grounded ≤ 0V Output Current = 0
> 1.5V Open (High) ≤ 0V Output Current = Short-Circuit Current
–20V < V
IN
< 20V Grounded ≤ 0V Output Current = 0
PACKAGE DESCRIPTION
U
MSOP (MS8) 1001
0.53 ± 0.015
(.021 ± .006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.077)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
0.13 ± 0.05
(.005 ± .002)
0.86
(.034)
REF
0.65
(.0256)
BCS
0
° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
12
3
4
4.88
± 0.1
(.192 ± .004)
8
7
6
5
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
3.00 ± 0.102
(.118 ± .004)
NOTE 4
0.52
(.206)
REF
5.23
(.206)
MIN
3.2 – 3.45
(.126 – .136)
0.889
± 0.127
(.035 ± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42 ± 0.04
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
