DMT6009LSS
Document number: DS38289 Rev. 1 - 2
October 2015
© Diodes Incorporated
ADVA N C E INF O RMA TION
Maximum Ratings (@T
A
= +25°C, unless otherwise specified.)
Continuous Drain Current (Note 6) V
GS
= 10V
Maximum Continuous Body Diode Forward Current (Note 6)
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)
Avalanche Current, L = 0.1mH
Avalanche Energy, L = 0.1mH
Thermal Characteristics (@T
A
= +25°C, unless otherwise specified.)
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
Electrical Characteristics (@T
A
= +25°C, unless otherwise specified.)
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
ON CHARACTERISTICS (Note 7)
V
DS
= V
GS
, I
D
= 250μA
Static Drain-Source On-Resistance
DYNAMIC CHARACTERISTICS (Note 8)
V
DS
= 30V, V
GS
= 0V,
f = 1MHz
Reverse Transfer Capacitance
V
DS
= 0V, V
GS
= 0V, f = 1MHz
Total Gate Charge (V
GS
= 10V)
Total Gate Charge (V
GS
= 4.5V)
V
DD
= 30V, V
GS
= 10V,
R
G
= 6Ω, I
D
= 13.5A
Body Diode Reverse Recovery Time
I
F
= 13.5A, di/dt = 400A/μs
Body Diode Reverse Recovery Charge
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz. copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz. copper, with 1inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.