74ABT540D,602

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74ABT540
Octal buffer, inverting (3-State)
Product specification
Supersedes data of 1996 Oct 08
1998 Jan 16
INTEGRATED CIRCUITS
IC23 Data Handbook
Philips Semiconductors Product specification
74ABT540Octal buffer, inverting (3-State)
2
1998 Jan 16 853–1609 18864
FEATURES
Octal bus interface
3-State buffers
Live insertion/extraction permitted
Efficient pinout to facilitate PC board layout
Output capability: +64mA/–32mA
Latch-up protection exceeds 500mA per Jedec JC40.2 Std 17
ESD protection exceeds 2000 V per MIL STD 883 Method 3015
and 200 V per Machine Model
Power-up 3-State
DESCRIPTION
The 74ABT540 high-performance BiCMOS device combines low
static and dynamic power dissipation with high speed and high
output drive.
The 74ABT540 device is an octal inverting buffer that is ideal for
driving bus lines. The device features input and outputs on opposite
sides of the package to facilitate printed circuit board layout.
QUICK REFERENCE DATA
SYMBOL PARAMETER
CONDITIONS
T
amb
= 25°C; GND = 0V
TYPICAL UNIT
t
PLH
t
PHL
Propagation delay
An to Yn
C
L
= 50pF; V
CC
= 5V 3.1 ns
C
IN
Input capacitance V
I
= 0V or V
CC
3 pF
C
OUT
Output capacitance Outputs disabled; V
O
= 0V or V
CC
7 pF
I
CCZ
Total supply current Outputs disabled; V
CC
= 5.5V 50 µA
ORDERING INFORMATION
PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER
20-Pin Plastic DIP –40°C to +85°C 74ABT540 N 74ABT540 N SOT146-1
20-Pin plastic SO –40°C to +85°C 74ABT540 D 74ABT540 D SOT163-1
20-Pin Plastic SSOP Type II –40°C to +85°C 74ABT540 DB 74ABT540 DB SOT339-1
20-Pin Plastic TSSOP Type I –40°C to +85°C 74ABT540 PW 74ABT540PW DH SOT360-1
PIN CONFIGURATION
1
2
3
4
5
6
7
8
9
10 11
12
13
14
15
16
17
18
19
20
OE0
A0
A1
A2
A3
A4
A5
A6
A7
GND
V
CC
OE1
Y
0
Y
1
Y
2
Y
3
Y
4
Y
5
Y
6
Y
7
SA00197
LOGIC SYMBOL
A0
A1
A2
A3
A4
A5
A6
A7
Y
0
Y
1
Y
2
Y
3
Y
4
Y
5
Y
6
Y
7
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
1
19
OE
0
OE
1
SA00198
Philips Semiconductors Product specification
74ABT540Octal buffer, inverting (3-State)
1998 Jan 16
3
LOGIC SYMBOL (IEEE/IEC)
EN
19
2
18
3
17
4
16
5
15
1
&
6
14
7
13
8
12
9
11
SA00199
PIN DESCRIPTION
PIN NUMBER SYMBOL NAME AND FUNCTION
2, 3, 4, 5,
6, 7, 8, 9
A0 – A7 Data inputs
18, 17, 16, 15,
14, 13, 12, 11
Y0 – Y7 Data outputs
1, 19 OE0, OE1 Output enables
10 GND Ground (0V)
20 V
CC
Positive supply voltage
FUNCTION TABLE
INPUTS OUTPUTS
OE0 OE1 An Yn
L
L
X
H
L
L
H
X
L
H
X
X
H
L
Z
Z
H =High voltage level
L =Low voltage level
X =Don’t care
Z =High impedance ”off” state
ABSOLUTE MAXIMUM RATINGS
1,
2
SYMBOL
PARAMETER CONDITIONS RATING UNIT
V
CC
DC supply voltage –0.5 to +7.0 V
I
IK
DC input diode current V
I
< 0 –18 mA
V
I
DC input voltage
3
–1.2 to +7.0 V
I
OK
DC output diode current V
O
< 0 –50 mA
V
OUT
DC output voltage
3
output in Off or High state –0.5 to +5.5 V
I
OUT
DC output current output in Low state 128 mA
T
stg
Storage temperature range –65 to 150 °C
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

74ABT540D,602

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC BUFFER INVERT 5.5V 20SO
Lifecycle:
New from this manufacturer.
Delivery:
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