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HSMN-C150

P1-P3P4-P6P7-P9
7
Figure 10. Recommended soldering pattern for HSMx-C110.
Figure 11. Recommended soldering pattern for HSMx-C120.
Figure 8. Recommended reow soldering prole. Figure 9. Recommended Pb-free reow soldering prole.
5.0 (0.200)
1.0 (0.039)
1.5
(0.059)
1.5
(0.059)
2.0
(0.079)
0.9 (0.035)
0.2 (0.008)
0.9 (0.035)
CENTERING
BOARD
1.2 (0.047)
1.2
(0.047)
0.9
(0.035)
1.2
(0.047)
0.8 (0.031)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
NOTE:
1. All dimensions in millimeters (inches).
Figure 12. Recommended soldering pattern for HSMx-C170.
Figure 13. Recommended soldering pattern for HSMX-C190/C191
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
TEMPERATURE
4°C/SEC. MAX.
140-160°C
3°C/SEC. MAX.
217 °C
200 °C
60 - 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
3 °C/SEC. MAX.
150 °C
255 - 260 °C
60 SEC. MAX.
10 SEC. MAX.
TIME
TEMPERATURE
0.7 (0.028)
0.8
(0.031)
0.8
(0.031)
1.2
(0.047)
0.4 (0.016)
0.15 (0.006)
0.4 (0.016)
CENTERING
BOARD
8
Figure 15. Reeling orientation.
Figure 16. Reel dimensions.
Figure 14. Recommended soldering pattern for HSMx-C150.
1.5 (0.059)
1.5
(0.059)
1.5
(0.059)
2.0
(0.079)
CATHODE SIDE
PRINTED LABEL
USER FEED DIRECTION
10.50 ± 1.0 (0.413 ± 0.039)
59.60 ± 1.00
(2.346 ± 0.039)
∅
20.20 MIN.
(
∅
0.795 MIN.)
6
PS
178.40 ± 1.00
(7.024 ± 0.039)
3.0 ± 0.5
(0.118 ± 0.020)
4.0 ± 0.5
(0.157 ± 0.020)
5.0 ± 0.5
(0.197 ± 0.020)
∅
13.1 ± 0.5
(
∅
0.516 ± 0.020)
8.0 ± 1.0 (0.315 ± 0.039)
NOTE:
1. All dimensions in millimeters (inches).
Figure 17. Tape dimensions.
Figure 18. Tape leader and trailer dimensions.
Reow Soldering:
For more information on reow solder-
ing, refer to Application Note AN-1060,
Surface Mounting SMT LED Indicator
Components.
Storage Condition:
5 to 30°C @ 60%RH max.
Baking is required before mounting, if:
1. Humidity Indicator Card is > 10% when
read at 23 ± 5°C.
2. Device expose to factory conditions
<30°C/60%RH more than 672 hours.
Recommended baking condition:
60±5°C for 20 hours.
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157)
1.50 (0.059)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (± 0.004)
DIM. B
± 0.10 (± 0.004)PART NUMBER
DIM. C
± 0.10 (± 0.004)
HSMx-C170 SERIES 2.30 (0.091) 1.45 (0.057) 0.95 (0.037)
HSMx-C190 SERIES 1.75 (0.069) 0.90 (0.035) 0.90 (0.035)
HSMx-C110 SERIES 3.40 (0.134) 1.70 (0.067) 1.20 (0.047)
HSMx-C191 SERIES 1.85 (0.073) 0.88 (0.035) 0.85 (0.033)
HSMx-C150 SERIES 3.50 (0.138) 1.88 (0.074) 1.27 (0.050)
HSMx-C110/120
POSITION IN
CARRIER TAPE
DIM. B
(SEE TABLE 1)
DIM. A
(SEE TABLE 1)
R 1.0 ± 0.05
(0.039 ± 0.002)
FOR HSMx-C110
R 0.5 ± 0.05
(0.020 ± 0.002)
FOR HSMx-C120
HSMx-C120 SERIES 1.90 (0.075) 1.15 (0.045) 0.75 (0.030)
END START
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
NOTES:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-0592EN - May 5, 2010
P1-P3P4-P6P7-P9

HSMN-C150

Mfr. #:
Buy HSMN-C150
Manufacturer:
Broadcom / Avago
Description:
Standard LEDs - SMD Blue Diffused 470nm 35mcd
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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