MAX2440/MAX2441/MAX2442
900MHz Image-Reject Receivers
10 ______________________________________________________________________________________
To disable the prescaler entirely, leave PREGND and
PREOUT floating. Also tie the MOD and DIV1 pins to
GND. Disabling the prescaler does not affect operation
of the VCO stage.
Power Management
MAX2440/MAX2441/MAX2442 supports three different
power-management features to conserve battery life.
The VCO section has its own control pin (VCOON),
which also serves as a master bias pin. When VCOON is
high, the LO, quadrature LO phase shifters, and
prescaler or LO buffer are all enabled. The VCO can be
powered up prior to receiving to allow it to stabilize. With
VCOON high, bringing RXON high enables the receive
path, which consists of the LNA, image-reject mixers,
and IF output buffer. When this pin is low, the receive
path is inactive.
To disable all chip functions and reduce the supply
current to typically less than 0.5µA, pull VCOON, DIV1,
MOD, and RXON low.
Applications Information
Oscillator Tank
The on-chip oscillator requires a parallel-resonant tank
circuit connected across TANK and TANK. Figure 2
shows an example of an oscillator tank circuit. Inductor
L4 provides DC bias to the tank ports. Inductor L3,
capacitor C26, and the series combination of capacitors
C2, C3, and both halves of the varactor diode capaci-
tance set the resonant frequency, as follows:
where C
D1
is the capacitance of one varactor diode.
Choose tank components according to your application
needs, such as phase-noise requirements, tuning
range, and VCO gain. High-Q inductors, such as air-
core micro springs, yield low phase noise. Use a low-
tolerance inductor (L3) for predictable oscillation
frequency. Resistors R6 and R7 can be chosen from 0
to 20 to reduce the Q of parasitic resonance due to
series package inductance (L
T
). Keep R6 and R7 as
small as possible to minimize phase noise, yet large
enough to ensure oscillator start-up in fundamental
mode. Oscillator start-up will be most critical with high
tuning bandwidth (low tank Q) and high temperature.
Capacitors C2 and C3 couple in the varactor. Light
coupling of the varactor is a way to reduce the effects
of high varactor tolerance and increase loaded Q. For a
wider tuning range; use larger values for C2 and C3 or
a varactor with a large capacitance ratio. Capacitor
C26 is used to trim the tank oscillator frequency. Larger
values for C26 will help negate the effect of stray PCB
capacitance and parasitic inductor capacitance (L3).
Choose a low tolerance capacitor for C26.
For applications that require a wide tuning range and
low phase noise, a series coupled resonant tank may
be required, as shown in Figure 4. This tank will use the
package inductance in series with inductors L1, L2,
and capacitance of varactor D1 to set the net equiva-
lent inductance which resonates in parallel with the
internal oscillator capacitance. Inductors L1 and L2
may be implemented as microstrip inductors, saving
component cost. Bias is provided to the tank port
through chokes L3 and L5. R1 and R3 should be cho-
sen large enough to de-Q the parasitic resonance due
to L3 and L5, but small enough to minimize the voltage
drop across them due to bias current. Values for R1
and R3 should be kept between 0 and 50. Proper
high-frequency bypassing (C1) should be used for the
bias voltage to eliminate power-supply noise from
entering the tank.
C =
1
1
C2
EFF
++
+
1
3
2
26
1
CC
C
D
f =
1
2L3C
r
EFF
π
()( )
MAX2440
MAX2441
MAX2442
L
T
L
T
L3
C26
L4
100nH
R5
1k
R4
1k
D1 = ALPHA SMV1299-004
SEE FIGURE 1 FOR R6, R7, C2, C3, C26, AND L3 COMPONENT VALUES.
1/2 D1
1/2 D1
C1
47pF
VCO_CTRL
R7
R6
C3
R8
47k
C2
V
CC
TANK
TANK
Figure 2. Oscillator Tank Schematic, Using the On-Chip VCO
Oscillator-Tank PC Board Layout
The parasitic PC board capacitance, as well as PCB
trace inductance and package inductance, can affect
oscillation frequency, so be careful in laying out the PC
board for the oscillator tank. Keep the tank layout as
symmetrical, tightly packed, and close to the device as
possible to minimize LO feedthrough. When using a PC
board with a ground plane, a cut-out in the ground
plane (and any other planes) below the oscillator tank
will reduce parasitic capacitance.
Using an External Oscillator
If an external 50 LO signal source is available, it can
be used as an input to the TANK or TANK pin in place
of the on-chip oscillator (Figure 3). The oscillator signal
is AC coupled into the TANK pin and should have a
level of about 0dBm from a 50 source. For proper
biasing of the oscillator input stage, TANK and TANK
must be pulled up to the V
CC
supply via 50 resistors.
If a differential LO source such as the MAX2620 is
available, AC couple the inverting output into TANK.
MAX2440/MAX2441/MAX2442
900MHz Image-Reject Receivers
______________________________________________________________________________________ 11
MAX2440/MAX2441/MAX2442
MAX2440
MAX2441
MAX2442
TANK
50
50
EXT LO
EXTERNAL LO LEVEL IS
0dBm FROM A 50
SOURCE.
V
CC
C
BLOCK
0.01µF
V
CC
TANK
Figure 3. Using an External Local Oscillator
TRANSISTOR COUNT: 2802
MAX2440
MAX2441
MAX2442
TANK
L1
L2
L3
L4
L5
R1
R2
R3
Ci
1/2 D1
1/2 D1
C1
V
CC
VTUNE
TANK
L
T
L
T
C2
Figure 4. Series Coupled Resonant Tank for Wide Tuning Range and Low Phase Noise
Chip Information
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages
.)
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2000 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.
MAX2440/MAX2441/MAX2442
900MHz Image-Reject Receivers
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2003 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.
Functional Diagram
RXON
CAP1
RXIN
LNAGAIN
90°
90°0°
Σ
MAX2440
MAX2441
MAX2442
PHASE
SHIFTER
÷1/64/65
BIAS
RXOUT
DIV1
MOD
PREOUT
PREGND
TANK
TANK
VCOON
0°
SSOP.EPS
PACKAGE OUTLINE, SSOP, 5.3 MM
1
1
21-0056
C
REV.DOCUMENT CONTROL NO.APPROVAL
PROPRIETARY INFORMATION
TITLE:
NOTES:
1. D&E DO NOT INCLUDE MOLD FLASH.
2. MOLD FLASH OR PROTRUSIONS NOT TO EXCEED .15 MM (.006").
3. CONTROLLING DIMENSION: MILLIMETERS.
4. MEETS JEDEC MO150.
5. LEADS TO BE COPLANAR WITHIN 0.10 MM.
7.90
H
L
0∞
0.301
0.025
8∞
0.311
0.037
0∞
7.65
0.63
8∞
0.95
MAX
5.38
MILLIMETERS
B
C
D
E
e
A1
DIM
A
SEE VARIATIONS
0.0256 BSC
0.010
0.004
0.205
0.002
0.015
0.008
0.212
0.008
INCHES
MIN
MAX
0.078
0.65 BSC
0.25
0.09
5.20
0.05
0.38
0.20
0.21
MIN
1.73 1.99
MILLIMETERS
6.07
6.07
10.07
8.07
7.07
INCHES
D
D
D
D
D
0.239
0.239
0.397
0.317
0.278
MIN
0.249
0.249
0.407
0.328
0.289
MAX
MIN
6.33
6.33
10.33
8.33
7.33
14L
16L
28L
24L
20L
MAX
N
A
D
e
A1
L
C
HE
N
12
B
0.068

MAX2440EAI+

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
RF Receiver Integrated Circuits (ICs)
Lifecycle:
New from this manufacturer.
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