FDS4410

April 1998
FDS4410
Single N-Channel Logic Level PWM Optimized PowerTrench
TM
MOSFET
General Description Features
Absolute Maximum Ratings T
A
= 25
o
C unless other wise noted
Symbol Parameter FDS4410 Units
V
DSS
Drain-Source Voltage 30 V
V
GSS
Gate-Source Voltage ±20 V
I
D
Drain Current - Continuous (Note 1a) 10 A
- Pulsed 50
P
D
Power Dissipation for Single Operation (Note 1a) 2.5 W
(Note 1b) 1.2
(Note 1c) 1
T
J
,T
STG
Operating and Storage Temperature Range -55 to 150 °C
THERMAL CHARACTERISTICS
R
θ
JA
Thermal Resistance, Junction-to-Ambient (Note 1a) 50 °C/W
R
θ
JC
Thermal Resistance, Junction-to-Case (Note 1) 25 °C/W
FDS4410 Rev.B1
10 A, 30 V. R
DS(ON)
= 0.0135 @ V
GS
= 10 V
R
DS(ON)
= 0.0200 @ V
GS
= 4.5 V.
Optimized for use in switching DC/DC converters
with PWM controllers.
Very fast switching .
Low gate charge (typical 22 nC).
SOT-23
SuperSOT
TM
-8
SOIC-16
SO-8 SOT-223SuperSOT
TM
-6
This N-Channel Logic Level MOSFET has been designed
specifically to improve the overall efficiency of DC/DC
converters using either synchronous or conventional
switching PWM controllers.
The MOSFET features faster switching and lower gate
charge than other MOSFETs with comparable R
DS(ON)
specifications.
The result is a MOSFET that is easy and safer to drive
(even at very high frequencies), and DC/DC power supply
designs with higher overall efficiency.
1
6
7
8
2
4
3
5
S
D
S
S
SO-8
D
D
D
G
pin
1
FDS
4410
© 1998 Fairchild Semiconductor Corporation
Electrical Characteristics (T
A
= 25
O
C unless otherwise noted )
Symbol Parameter Conditions Min Typ Max Units
OFF CHARACTERISTICS
BV
DSS
Drain-Source Breakdown Voltage V
GS
= 0 V, I
D
= 250 µA 30 V
BV
DSS
/T
J
Breakdown Voltage Temp. Coefficient I
D
= 250 µA, Referenced to 25
o
C 21 mV /
o
C
I
DSS
Zero Gate Voltage Drain Current V
DS
= 24 V, V
GS
= 0 V 1 µA
T
J
= 55°C 10 µA
I
GSSF
Gate - Body Leakage, Forward V
GS
= 20 V, V
DS
= 0 V 100 nA
I
GSSR
Gate - Body Leakage, Reverse V
GS
= -20 V, V
DS
= 0 V -100 nA
ON CHARACTERISTICS (Note 2)
V
GS(th)
Gate Threshold Voltage V
DS
= V
GS
, I
D
= 250 µA 1 2 3 V
V
GS(th)
/T
J
Gate Threshold Voltage Temp. Coefficient I
D
= 250 µA, Referenced to 25
o
C -4.5 mV /
o
C
R
DS(ON)
Static Drain-Source On-Resistance V
GS
= 10 V, I
D
= 10 A 0.011 0.0135
T
J
=125°C 0.018 0.023
V
GS
= 4.5 V, I
D
= 9 A 0.017 0.02
I
D(ON)
On-State Drain Current V
GS
= 10 V, V
DS
= 5 V 50 A
g
FS
Forward Transconductance V
DS
= 10 V, I
D
= 10 A 27 S
DYNAMIC CHARACTERISTICS
C
iss
Input Capacitance V
DS
= 15 V, V
GS
= 0 V,
f = 1.0 MHz
1340 pF
C
oss
Output Capacitance 340 pF
C
rss
Reverse Transfer Capacitance 125 pF
SWITCHING CHARACTERISTICS (Note 2)
t
D(on)
Turn - On Delay Time V
DS
= 15 V, I
D
= 1 A 12 22 ns
t
r
Turn - On Rise Time
V
GS
= 10 V , R
GEN
= 6
13 24 ns
t
D(off)
Turn - Off Delay Time 38 60 ns
t
f
Turn - Off Fall Time 10 18 ns
Q
g
Total Gate Charge V
DS
= 15 V, I
D
= 10 A, 22 31 nC
Q
gs
Gate-Source Charge V
GS
= 10 V 5 nC
Q
gd
Gate-Drain Charge 4 nC
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
I
S
Maximum Continuous Drain-Source Diode Forward Current 2.1 A
V
SD
Drain-Source Diode Forward Voltage V
GS
= 0 V, I
S
= 2.1 A
(Note 2) 0.73 1.2 V
Notes:
1. R
θ
JA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R
θ
JC
is
guaranteed by design while R
θ
CA
is determined by the user's board design.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.
FDS4410 Rev.B1
c. 125
O
C/W on a 0.006 in
2
pad
of 2oz copper.
b. 105
O
C/W on a 0.04 in
2
pad of 2oz copper.
a. 50
O
C/W on a 1 in
2
pad
of 2oz copper.
FDS4410 Rev.B1
0 0.5 1 1.5 2 2.5 3
0
10
20
30
40
50
V , DRAIN-SOURCE VOLTAGE (V)
I , DRAIN-SOURCE CURRENT (A)
V =10V
GS
3.5V
5.0V
4.5V
4.0V
DS
D
6.0V
Typical Electrical Characteristics
Figure 1. On-Region Characteristics.
Figure 2. On-Resistance Variation with
Drain Current and Gate Voltage.
-50 -25 0 25 50 75 100 125 150
0.6
0.8
1
1.2
1.4
1.6
1.8
T , JUNCTION TEMPERATURE (°C)
DRAIN-SOURCE ON-RESISTANCE
J
V = 10 V
GS
I = 10 A
D
R , NORMALIZED
DS(ON)
Figure 3. On-Resistance Variation with
Temperature.
2 3 4 5
0
10
20
30
40
50
V , GATE TO SOURCE VOLTAGE (V)
I , DRAIN CURRENT (A)
GS
25°C
125°C
V = 5V
DS
D
T = -55°C
A
Figure 5 . Transfer Characteristics.
0 0.2 0.4 0.6 0.8 1 1.2 1.4
0.0001
0.001
0.01
0.1
1
10
50
V , BODY DIODE FORWARD VOLTAGE (V)
I , REVERSE DRAIN CURRENT (A)
T = 125°C
A
25°C
-55°C
V = 0V
GS
SD
S
Figure 6 . Body Diode Forward Voltage
Variation with Source Current
and Temperature.
Figure 4 . On-Resistance Variation with
Gate-to-Source Voltage.
2 4 6 8 10
0
0.01
0.02
0.03
0.04
0.05
V , GATE TO SOURCE VOLTAGE (V)
GS
R , ON-RESISTANCE (OHM)
DS(ON)
T = 25°C
A
I = 5A
D
T = 125°C
A
0 10 20 30 40 50
0.5
1
1.5
2
2.5
3
I , DRAIN CURRENT (A)
DRAIN-SOURCE ON-RESISTANCE
V = 3.5V
GS
10V
4.0V
4.5V
D
5.5V
7.0V
R
DS(on)
, NORMALIZED
5.0V

FDS4410

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET N-CH 30V 10A 8SOIC
Lifecycle:
New from this manufacturer.
Delivery:
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