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SP6001-04UTG-1

P1-P3P4-P4
169
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA
™
Family of Products)
Revision: March 20, 2012
SP6001 Series
SP6001
ESD and EMI Filter Devices - SP6001 Series
Description
Applications
The Littelfuse SP6001 SPA series integrates 4, 6 and 8
EMI filters (C-R-C) into a small, low-profile DFN package
with each filter providing greater than -30dB attenuation at
1GHz. Additionally, each I/O is capable of shunting ±30kV
ESD strikes (IEC61000-4-2, contact discharge) away from
sensitive electronic components. The performance of this
small, slim design makes it extremely suitable for mobile
handsets, PDAs and notebook computers.
Features
t&.*mMUFSJOHPG
frequencies from
800MHz to 3GHz
t(SFBUFSUIBOE#
attenuation (TYP) at 1GHz
t&4%*&$
±30kV contact, ±30kV air
t4NBMMMPXQSPmMFç%'/
(JEDEC MO-229) package
(TYP 0.5mm height)
t,FZQBEJOUFSGBDFGPS
portable electronics
t-$%BOEDBNFSBEJTQMBZ
interfaces for handsets
t$POOFDUPSJOUFSGBDFTGPS
portable electronics
t.PCJMFQIPOF
t4NBSUQIPOF
t1PSUBCMFOBWJHBUJPO
device
Pinout
5
8
1
4
1
6
7
12
GND
18
9
16
GND
GND
SP6001-04UTG-1
SP6001-06UTG-1
μDFN-08
μDFN-12
SP6001-08UTG-1
μDFN-16
Functional Block Diagram
Cd Cd
18
Cd Cd
27
Cd Cd
36
Cd Cd
4 5
Cd Cd
1
12
Cd Cd
2
11
Cd Cd
3
10
Cd Cd
4
9
Cd Cd
5
8
Cd Cd
67
SP6001-04UTG-1
SP6001-06UTG-1
RoHS
Pb
GREEN
Application Examples
Baseband
D1
PCB Connector
for LCD Display
D2
IC
D3
D4
D1
Camera Module
D2
IC
D3
D4
Baseband
D5
D6
D7
D8
SP6001-04UTG-1
SP6001-08UTG-1
SP6001 Series 12pF 30kV EMI Filter Array
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
170
TVS Diode Arrays (SPA
™
Family of Products)
Revision: March 20, 2012
SP6001 Series
ESD and EMI Filter Devices - SP6001 Series
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Absolute Maximum Ratings
Symbol Parameter Value Units
T
OP
Operating Temperature -40 to 85 °C
T
STOR
Storage Temperature -60 to 150 °C
Thermal Information
Parameter Rating Units
Storage Temperature Range -65 to 150 °C
Maximum Junction Temperature 150 °C
Maximum Lead Temperature
(Soldering 20-40s)
260 °C
Electrical Characteristics (T
OP
=25ºC)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Standoff Voltage V
RWM
6.0 V
Breakdown Voltage V
BR
I
R
=1mA 7.0 (90%TYP) 7.8 8.5 (109%TYP) V
Reverse Leakage Current I
LEAK
V
RWM
=5V 0.1 1.0 µA
Resistance R
A
I
R
=10mA 85 (85%TYP) 100 115 (115% TYP)
Diode Capacitance
1,2
C
D
V
R
=2.5V,f=1MHz 12 pF
Line Capacitance
1,2
C
L
V
R
=2.5V,f=1MHz 19 (79.2%TYP) 24 29 (120.8%TYP) pF
ESD Withstand Voltage
1
V
ESD
IEC61000-4-2 (Contact Discharge) ±30 kV
IEC61000-4-2 (Air Discharge) ±30 kV
Cutoff Frequency
3
F
-3dB
Above this frequency, appreciable
attenutation occurs
115 MHz
Notes:
1
Parameter is guaranteed by design and/or device characterization.
2
Total line capacitance is two times the diode capacitance (C
D
).
3
50 source and 50 load termination
Analog Crosstalk (S41)Insertion Loss (S21)
3.000 000MHz
Stop 6 000.000.000MHz
x2
Start
21 log MAG 5 dB/ REF 0 dB 1 _:-5.8807 dB
CH1 S
Cor
Smo
1
START
3.000 000 MHz
Stop 6 000.000 000 MHz
x2
CH1 S
log MAG 10 dB/
REF 0 dB
Smo
Cor
Del
1
Product Characteristics
Lead Plating Pre-Plated Frame
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
171
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA
™
Family of Products)
Revision: March 20, 2012
SP6001 Series
SP6001
ESD and EMI Filter Devices - SP6001 Series
Line Capacitance vs. DC Bias
0
10
20
30
40
50
DC Bias (V)
Capacitance (pF)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Time
Temperature
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
Preheat
P
rehea
t
Ramp-up
R
amp-up
Ramp-down
R
amp-d
o
Critical Zone
T
L to TP
C
ritical Zone
T
L
to
T
P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (min to max) (t
s
) 60 – 180 secs
Average ramp up rate (Liquidus) Temp
(T
L
) to peak
3°C/second max
T
S(max)
to T
L
- Ramp-up Rate 3°C/second max
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Temperature (t
L
) 60 – 150 seconds
Peak Temperature (T
P
) 260
+0/-5
°C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (T
P
) 8 minutes Max.
Do not exceed 260°C
Soldering Parameters
Package Dimensions — μDFN-16
μDFN-16
JEDEC MO-229
Millimeters Inches
Min Max Min Max
A 0.45 0.55 0.01 0.02
A1 0.00 0.05 0.00 0.002
A3 0.127 REF 0.00 REF
b 0.15 0.25 0.00 0.00
D 3.20 3.40 0.12 0.13
D2 2.70 2.90 0.10 0.11
E 1.25 1.45 0.04 0.05
E2 0.30 0.50 0.01 0.01
e 0.40 BSC 0.01 BSC
K 0.20 0.00
L 0.15 0.35 0.00 0.01
D
E
A3
D2
A
A1
E2
L
b
e
K
Package Dimensions — μDFN-08
μDFN-08
JEDEC MO-229
Millimeters Inches
Min Max Min Max
A 0.450 0.550 0.018 0.022
A1 0.000 0.050 0.000 0.002
A3 0.127 REF 0.005 REF
b 0.150 0.250 0.006 0.010
D 1.600 1.800 0.063 0.071
D2 1.100 1.300 0.043 0.051
E 1.250 1.450 0.049 0.057
E2 0.300 0.500 0.012 0.020
e 0.400 BSC 0.016 BSC
K 0.200 0.008 0.000
L 0.150 0.350 0.006 0.014
D
E
A
A1
A3
D2
E2
L
K
b
e
Package Dimensions — μDFN-12
μDFN-12
JEDEC MO-229
Millimeters Inches
Min Max Min Max
A 0.450 0.550 0.018 0.022
A1 0.000 0.050 0.000 0.002
A3 0.127 REF 0.005 REF
b 0.150 0.250 0.006 0.010
D 2.400 2.600 0.094 0.102
D2 1.900 2.100 0.075 0.083
E 1.250 1.450 0.049 0.057
E2 0.300 0.500 0.012 0.020
e 0.400 BSC 0.016 BSC
K 0.200 0.008 0.000
L 0.150 0.350 0.006 0.014
D
E
A
A1
A3
D2
E2
L
K
b
e
P1-P3P4-P4

SP6001-04UTG-1

Mfr. #:
Buy SP6001-04UTG-1
Manufacturer:
Littelfuse
Description:
ESD Suppressors / TVS Diodes 4 Ch 15kV 5V 12pF EMI Filter
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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