Vishay Siliconix
Si7192DP
New Product
Document Number: 69815
S-80790-Rev. B, 14-Apr-08
www.vishay.com
1
N-Channel 30-V (D-S) MOSFET
FEATURES
Halogen-free
TrenchFET
®
Gen III Power MOSFET
100 % R
g
Tested
100 % Avalanche Tested
APPLICATIONS
VRM, POL, Server
High Current DC/DC
- Low-Side
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)
I
D
(A)
a
Q
g
(Typ.)
30
0.0019 at V
GS
= 10 V
60
43.5 nC
0.00225 at V
GS
= 4.5 V
60
Ordering Information: Si7192DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
1
2
3
4
5
6
7
8
S
S
S
G
D
D
D
D
6.15 mm
5.15 mm
PowerPAK
®
SO-8
Bottom View
N-Channel MOSFET
G
D
S
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See Solder Profile (
http://www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 54 °C/W.
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
30
V
Gate-Source Voltage
V
GS
± 20
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
60
a
A
T
C
= 70 °C
60
a
T
A
= 25 °C
42
b, c
T
A
= 70 °C
34
b, c
Pulsed Drain Current
I
DM
100
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
60
a
T
A
= 25 °C
5.6
b, c
Single Pulse Avalanche Current
L = 0.1 mH
I
AS
50
Single Pulse Avalanche Energy
E
AS
125
mJ
Maximum Power Dissipation
T
C
= 25 °C
P
D
104
W
T
C
= 70 °C
66.6
T
A
= 25 °C
6.25
b, c
T
A
= 70 °C
4.0
b, c
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)
d, e
260
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
b, f
t 10 s
R
thJA
15 20
°C/W
Maximum Junction-to-Case (Drain) Steady State
R
thJC
0.9 1.2
RoHS
COMPLIANT
www.vishay.com
2
Document Number: 69815
S-80790-Rev. B, 14-Apr-08
Vishay Siliconix
Si7192DP
New Product
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= 250 µA
30 V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= 250 µA
26
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)
/T
J
- 6.1
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA
1.0 2.5 V
Gate-Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 20 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= 30 V, V
GS
= 0 V
1
µA
V
DS
= 30 V, V
GS
= 0 V, T
J
= 55 °C
10
On-State Drain Current
a
I
D(on)
V
DS
5 V, V
GS
= 10 V
30 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= 10 V, I
D
= 20 A
0.00155 0.0019
Ω
V
GS
= 4.5 V, I
D
= 20 A
0.00185 0.00225
Forward Transconductance
a
g
fs
V
DS
= 15 V, I
D
= 20 A
107 S
Dynamic
b
Input Capacitance
C
iss
V
DS
= 15 V, V
GS
= 0 V, f = 1 MHz
5800
pFOutput Capacitance
C
oss
1050
Reverse Transfer Capacitance
C
rss
440
Total Gate Charge
Q
g
V
DS
= 15 V, V
GS
= 10 V, I
D
= 20 A
90 135
nC
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 20 A
43.5 66
Gate-Source Charge
Q
gs
14
Gate-Drain Charge
Q
gd
12.5
Gate Resistance
R
g
f = 1 MHz 1.1 2 Ω
Tur n - O n D e l ay Time
t
d(on)
V
DD
= 15 V, R
L
= 1.5 Ω
I
D
10 A, V
GEN
= 10 V, R
g
= 1 Ω
15 30
ns
Rise Time
t
r
10 20
Turn-Off Delay Time
t
d(off)
47 80
Fall Time
t
f
918
Tur n - O n D e l ay Time
t
d(on)
V
DD
= 15 V, R
L
= 1.5 Ω
I
D
10 A, V
GEN
= 4.5 V, R
g
= 1 Ω
41 75
Rise Time
t
r
26 50
Turn-Off Delay Time
t
d(off)
86 150
Fall Time
t
f
32 60
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
I
S
T
C
= 25 °C
60
A
Pulse Diode Forward Current
a
I
SM
100
Body Diode Voltage
V
SD
I
S
= 5 A
0.74 1.1 V
Body Diode Reverse Recovery Time
t
rr
I
F
= 10 A, di/dt = 100 A/µs, T
J
= 25 °C
44 70 ns
Body Diode Reverse Recovery Charge
Q
rr
50 90 nC
Reverse Recovery Fall Time
t
a
22
ns
Reverse Recovery Rise Time
t
b
22
Document Number: 69815
S-80790-Rev. B, 14-Apr-08
www.vishay.com
3
Vishay Siliconix
Si7192DP
New Product
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Output Characteristics
On-Resistance vs. Drain Current and Gate Voltage
Gate Charge
0
14
28
42
56
70
0.0 0.5 1.0 1.5 2.0 2.5
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)I
D
V
GS
=10thru 3 V
0.0014
0.0016
0.0018
0.0020
0.0022
0.0024
0 20406080 100
- On-Resistance (Ω)R
DS(on)
I
D
- Drain Current (A)
V
GS
=10V
V
GS
=4.5V
0
2
4
6
8
10
0 20406080 100
I
D
=20A
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
V
DS
=20V
V
DS
=10V
V
DS
=15V
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0
1
2
3
4
5
012345
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A)I
D
T
C
= 25 °C
T
C
= - 55 °C
T
C
= 125 °C
C
rss
0
1500
3000
4500
6000
7500
0 5 10 15 20 25 30
C
oss
C
iss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
0.7
0.9
1.1
1.3
1.5
1.7
- 50 - 25 0 25 50 75 100 125 150
T
J
- Junction Temperature (°C)
(Normalized)
- On-Resistance
R
DS(on)
I
D
=20A
V
GS
=10V
V
GS
=4.5V

SI7192DP-T1-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET 30V 60A 104W 1.9mohm @ 10V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet