LA T67F-U2AB-24-1-Z

P1-P3 P4-P6 P7-P9 P10-P12 P13-P15 P16-P18 P19-P20

2013-10-08 10

Version 1.0 LA T67F

Max. Permissible Forward Current

Max. zulässiger Durchlassstrom

I

F

= f (T)

Permissible Pulse Handling Capability

Zulässige Impulsbelastbarkeit I

F

= f(t

p

)

D: Duty cycle, T

A

= 25 °C

Permissible Pulse Handling Capability

Zulässige Impulsbelastbarkeit I

F

= f(t

p

)

D: Duty cycle, T

A

= 85 °C

temp. ambient

temp. solder point

0

02040

A

S

T

T

˚C60 80 100

T

I

F

mA

S

T

OHL03044

T

A

10

20

30

40

50

60

0

-5

F

I

A

t

p

s

OHL03045

-4

10

-3

10

-2

10

-1

10

0

10

1

10

2

1010

0.02

0.04

0.06

0.08

0.10

0.12

D

P

t

P

=

T

t

T

I

F

0.02

0.05

0.1

0.005

0.01

D

=

0.2

0.5

1

0

-5

F

I

A

t

p

s

OHL03045

-4

10

-3

10

-2

10

-1

10

0

10

1

10

2

1010

0.02

0.04

0.06

0.08

0.10

0.12

D

P

t

P

=

T

t

T

I

F

0.02

0.05

0.1

0.005

0.01

D

=

0.2

0.5

1

Version 1.0 LA T67F

2013-10-08 11

Package Outline

9) page 19

Maßzeichnung

9) Seite 19

Approximate Weight: 34 mg

Gewicht: 34 mg

Mark: bevelled edge (Cathode)

Markierung: abgeschrägte Ecke (Kathode)

Corrosion robustness: Test conditions: 40 °C / 90 % rh / 15 ppm H

2

S / 336 h

= Stricter than IEC 60068-2-43 (H

2

S) [25°C / 75 % rh

/ 10 ppm H

2

S / 21 days]

= Regarding relevant gas (H

2

S) stricter than EN

60068-2-60 (method 4) [25 °C / 75 % rh / 200 ppb

SO

2

, 200 ppb NO

2,

10 ppb Cl

2

/ 21 days]

Korrosionsfestigkeit: Test Kondition: 40°C / 90 % rh / 15 ppm H

2

S / 336 h

= Besser als IEC 60068-2-43 (H

2

S) [25°C / 75 % rh /

10 ppm H

2

S / 21 Tage]

= Bezogen auf das Gas (H

2

S) besser als EN

60068-2-60 (method 4) [25°C / 75 % rh / 200ppb

SO

2

, 200ppb NO

2,

10ppb Cl

2

/ 21 Tage]

GPLY6724

0.7 (0.028)

0.9 (0.035)

1.7 (0.067)

2.1 (0.083)

0.12 (0.005)

0.18 (0.007)

0.5 (0.020)

1.1 (0.043)

3.3 (0.130)

3.7 (0.146)

0.4 (0.016)

0.6 (0.024)

2.6 (0.102)

3.0 (0.118)

2.1 (0.083)

2.3 (0.091)

Cathode marking

3.0 (0.118)

3.4 (0.134)

(2.4) (0.095)

0.1 (0.004) (typ.)

4˚±1

A

C

2013-10-08 12

Version 1.0 LA T67F

Recommended Solder Pad

9) page 19

Reflow soldering

Empfohlenes Lötpaddesign

9) Seite 19

Reflow-Löten

Recommended Solder Pad

9) page 19

Reflow soldering

Empfohlenes Lötpaddesign

9) Seite 19

Reflow-Löten

OHLPY970

4.5 (0.177)

2.6 (0.102)

1.5 (0.059)

Cu-area > 16 mm

Cu-Fläche > 16 mm

2

2

Solder resist

Lötstopplack

4.5 (0.177)

1.5 (0.059)

2.6 (0.102)

Padgeometrie für

improved heat dissipation

verbesserte Wärmeableitung

Paddesign for

OHLPY440

Padgeometrie für

verbesserte Wärmeableitung

improved heat dissipation

Paddesign for

Lötstoplack

Solder resist

0.8 (0.031)

3.7 (0.146)

1.1 (0.043)

2.3 (0.091)

3.3 (0.130)

1.5 (0.059)

11.1 (0.437)

Cu Fläche / 16 mm per pad

2

Cu-area

_

<

3.3 (0.130)

Kathode/

Cathode

Anode

0.7 (0.028)

Fläche darf bei Verwendung von TOPLED

®

For TOPLED

®

assembly do not use

elektrisch nicht beschaltet werden.

this area for electrical contact

Fläche darf bei Verwendung von TOPLED

®

For TOPLED

®

assembly do not use

elektrisch nicht beschaltet werden.

this area for electrical contact

P1-P3 P4-P6 P7-P9 P10-P12 P13-P15 P16-P18 P19-P20

LA T67F-U2AB-24-1-Z

Mfr. #:

Buy LA T67F-U2AB-24-1-Z

Manufacturer:

Description:

Standard LEDs - SMD Amber 617nm 1800mcd 20mA

Lifecycle:

New from this manufacturer.

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LA T67F-U2AB-24-1-Z