High Performance Surface Mount
Chip LEDs
Technical Data
HSMx-S660 Series
HSMx-S670 Series
HSMx-S690 Series
Features
• High Brightness AlInGaP
Material
• Industry Standard 2.00 x
1.25 mm Package
• Industry Standard 1.6 x 0.8
mm (Low Profile) Package
• Right Angle Package
• Three Colors Available
• Diffused Optics
• Compatible with IR Solder
Process
• Available in 8 mm Tape on
7” (178 mm) Diameter Reels
Applications
• Keypad Backlighting
• LCD Backlighting
• Symbol Backlighting
• Front Panel Indicator
Description
These chip-type LEDs utilize
aluminum indium gallium
phosphide (AlInGaP) material
technology. The AlInGaP material
has a very high luminous
efficiency, capable of producing
high light output over a wide
range of drive currents. The 590
nm amber, 605 nm orange, and
626 nm red colors are available
in three compact, low profile
packages.
The HSMx-S670 is the industry
standard 2.0 x 1.25 mm package,
and is an excellent all around
package. The HSMx-S690 is the
industry standard 1.6 x 0.8 mm
package. Its low 0.7 mm profile
and wide viewing angle make this
LED excellent for backlighting
SunPower Series
applications. The HSMx-S660
right angle, 3.0 x 2.0 x 1.0 mm
LED is optimum for side lighting
applications where direct back-
lighting is not practical.
All packages are compatible with
IR and convective reflow solder-
ing processes.
Device Selection Guide
Footprint Amber Orange Red
(mm)
[1][2]
590 nm 605 nm 626 nm
1.6 x 0.8 x 0.7 HSMA-S690 HSMD-S690 HSMC-S690
2.0 x 1.25 x 0.8 HSMA-S670 HSMD-S670 HSMC-S670
3.0 x 2.0 x 1.0 HSMA-S660 HSMD-S660 HSMC-S660
Notes:
1. Dimensions in mm.
2. Tolerance ± 0.1 mm unless otherwise noted.
