BSO104N03S

BSO104N03S
OptiMOS
2 Power-Transistor
Features
• Fast switching MOSFET for SMPS
• Optimized technology for notebook DC/DC converters
• Qualified according to JEDEC
1)
for target applications
• N-channel
• Logic level
• Excellent gate charge x R
DS(on)
product (FOM)
• Very low on-resistance R
DS(on)
• Superior thermal resistance
• Avalanche rated
• Pb-free plating; RoHS compliant
• Halogen-free according to IEC61249-2-21
Maximum ratings, at T
j
=25 °C, unless otherwise specified
Parameter Symbol Conditions Unit
10 secs steady state
Continuous drain current
I
D
T
A
=25 °C
2)
13 10 A
T
A
=70 °C
2)
10 8
Pulsed drain current
I
D,pulse
T
A
=25 °C
3)
Avalanche energy, single pulse
E
AS
I
D
=13 A, R
GS
=25
mJ
Reverse diode dv /dt dv /dt
I
D
=13 A, V
DS
=20 V,
di /dt =200 A/µs,
T
j,max
=150 °C
kV/µs
Gate source voltage
V
GS
V
Power dissipation
P
tot
T
A
=25 °C
2)
2.5 1.56 W
Operating and storage temperature
T
j
, T
stg
°C
IEC climatic category; DIN IEC 68-1
Value
55/150/56
-55 ... 150
±20
6
73
52
V
DS
30 V
R
DS(on),max
9.7
m
I
D
13 A
Product Summary
PG-DSO-8
Type Package Marking
BSO104N03S PG-DSO-8 104N3S
Rev. 1.7 page 1 2010-05-06
BSO104N03S
Parameter Symbol Conditions Unit
min. typ. max.
Thermal characteristics
Thermal resistance,
junction - soldering point
R
thJS
- - 35 K/W
Thermal resistance,
junction - ambient
R
thJA
minimal footprint,
t
p
10 s
- - 110
minimal footprint,
steady state
- - 150
6 cm
2
cooling area
2)
,
t
p
10 s
--50
6 cm
2
cooling area
2)
,
steady state
--80
Electrical characteristics, at T
j
=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V
(BR)DSS
V
GS
=0 V, I
D
=1 mA
30 - - V
Gate threshold voltage
V
GS(th)
V
DS
=V
GS
, I
D
=30 µA
1.2 1.6 2
Zero gate voltage drain current
I
DSS
V
DS
=30 V, V
GS
=0 V,
T
j
=25 °C
- 0.1 1 µA
V
DS
=30 V, V
GS
=0 V,
T
j
=125 °C
- 10 100
Gate-source leakage current
I
GSS
V
GS
=20 V, V
DS
=0 V
- 10 100 nA
Drain-source on-state resistance
R
DS(on)
V
GS
=4.5 V, I
D
=11 A
- 10.9 13.6
m
V
GS
=10 V, I
D
=13 A
- 8.1 9.7
Gate resistance
R
G
-1-
Transconductance
g
fs
|V
DS
|>2|I
D
|R
DS(on)max
,
I
D
=13 A
18 36 - S
3)
See figure 3
2)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm
2
(one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
Values
1)
J-STD20 and JESD22
Rev. 1.7 page 2 2010-05-06
BSO104N03S
Parameter Symbol Conditions Unit
min. typ. max.
Dynamic characteristics
Input capacitance
C
iss
- 1600 2130 pF
Output capacitance
C
oss
- 570 760
Reverse transfer capacitance
C
rss
- 75 110
Turn-on delay time
t
d(on)
- 5.0 7.5 ns
Rise time
t
r
- 4.2 6.3
Turn-off delay time
t
d(off)
-2131
Fall time
t
f
- 3.2 4.8
Gate Char
g
e Characteristics
4)
Gate to source charge
Q
gs
- 4.5 5.9 nC
Gate charge at threshold
Q
g(th)
- 2.6 3.4
Gate to drain charge
Q
gd
- 3.0 4.6
Switching charge
Q
sw
- 5.0 7.1
Gate charge total
Q
g
-1216
Gate plateau voltage
V
plateau
- 2.8 - V
Gate charge total, sync. FET
Q
g(sync)
V
DS
=0.1 V,
V
GS
=0 to 5 V
-1114nC
Output charge
Q
oss
V
DD
=15 V, V
GS
=0 V
-1418
Reverse Diode
Diode continous forward current
I
S
- - 2.5 A
Diode pulse current
I
S,pulse
--52
Diode forward voltage
V
SD
V
GS
=0 V, I
F
=2.5 A,
T
j
=25 °C
- 0.74 1 V
Reverse recovery charge
Q
rr
V
R
=12 V, I
F
=I
S
,
di
F
/dt =400 A/µs
- - 10 nC
4)
See figure 16 for gate charge parameter definition
T
A
=25 °C
Values
V
GS
=0 V, V
DS
=15 V,
f =1 MHz
V
DD
=15 V, V
GS
=10 V,
I
D
=6.5 A, R
G
=2.7
V
DD
=15 V, I
D
=6.5 A,
V
GS
=0 to 5 V
Rev. 1.7 page 3 2010-05-06

BSO104N03S

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET N-CH 30V 10A 8DSO
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet