DMP3050LSS-13

DMP3050LSS
Document number: DS35647 Rev. 4 - 2
1 of 6
www.diodes.com
September 2012
© Diodes Incorporated
DMP3050LSS
NEW PRODUCT
P-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
V
(BR)DSS
R
DS(ON)
max
I
D
max
T
A
= 25°C
-30V
45m @ V
GS
= -10V
-4.8A
80m @ V
GS
= -4.5V
-3.5A
Description
This MOSFET has been designed to minimize the on-state resistance
(R
DS(on)
) and yet maintain superior switching performance, making it
ideal for high efficiency power management applications.
Applications
Backlighting
Power Management Functions
DC-DC Converters
Features
Low On-Resistance
Low Input Capacitance
Fast Switching Speed
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 standards for High Reliability
Mechanical Data
Case: SO-8
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections Indicator: See diagram
Terminals: Finish Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.008 grams (approximate)
Ordering Information (Note 4)
Part Number Case Packaging
DMP3050LSS-13 SO-8 2500/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com.
Marking Information
SO-8
Top View
Top View
S
D
D
G
D
D
S
S
Equivalent Circuit
Source
Gate
Drain
Top View
Logo
Part no.
Year: “11” = 2011
1 4
8 5
P3050LS
YY
WW
Xth week: 01 ~ 53
DMP3050LSS
Document number: DS35647 Rev. 4 - 2
2 of 6
www.diodes.com
September 2012
© Diodes Incorporated
DMP3050LSS
NEW PRODUCT
Maximum Ratings (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Units
Drain-Source Voltage
V
DSS
-30 V
Gate-Source Voltage (Note 4)
V
GSS
±25 V
Continuous Drain Current (Note 5) V
GS
= -10V
Steady
State
T
A
= 25°C
T
A
= 70°C
I
D
-4.8
-3.8
A
t<10s
T
A
= 25°C
T
A
= 70°C
I
D
-6.3
-4.9
A
Maximum Continuous Body Diode Forward Current (Note 6)
I
S
-3.0 A
Pulsed Drain Current (10μs pulse, duty cycle = 1%)
I
DM
-30 A
Thermal Characteristics (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Units
Total Power Dissipation (Note 5)
T
A
= 25°C
P
D
1.7
W
T
A
= 70°C
1.1
Thermal Resistance, Junction to Ambient (Note 5)
Steady State
R
θ
JA
73
°C/W
t<10s 37
Operating and Storage Temperature Range
T
J,
T
STG
-55 to 150 °C
Electrical Characteristics (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
BV
DSS
-30 - - V
V
GS
= 0V, I
D
= -250A
Zero Gate Voltage Drain Current
I
DSS
- - -1 A
V
DS
= -30V, V
GS
= 0V
Gate-Source Leakage
I
GSS
- - ±100 nA
V
GS
= ±25V, V
DS
= 0V
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
V
GS
(
th
)
-1.0 - -2.0 V
V
DS
= V
GS
, I
D
= -250A
Static Drain-Source On-Resistance
R
DS (ON)
- 36 45
mΩ
V
GS
= -10V, I
D
= -6A
- 61 80
V
GS
= -4.5V, I
D
= -5A
Forward Transfer Admittance
|Y
fs
|
- 4.8 - S
V
DS
= -10V, I
D
= -5.3A
Diode Forward Voltage
V
SD
- -0.7 -1.0 V
V
GS
= 0V, I
S
= -1.7A
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
C
iss
- 620 - pF
V
DS
= -15V, V
GS
= 0V,
f = 1.0MHz
Output Capacitance
C
oss
- 83 - pF
Reverse Transfer Capacitance
C
rss
- 62 - pF
Gate resistance
R
g
- 10.8 -
Ω
V
DS
= 0V, V
GS
= 0V, f = 1.0MHz
Total Gate Charge (V
GS
= -4.5V) Q
g
- 5.1 - nC
V
DS
= -15V, I
D
= -6A
Total Gate Charge (V
GS
= -10V) Q
g
- 10.5 - nC
Gate-Source Charge
Q
g
s
- 1.8 - nC
Gate-Drain Charge
Q
g
d
- 1.9 - nC
Turn-On Delay Time
t
D
(
on
)
- 6.8 - ns
V
DD
= -15V, V
GS
= -10V,
R
G
= 6, I
D
= -1A
Turn-On Rise Time
t
r
- 4.9 - ns
Turn-Off Delay Time
t
D
(
off
)
- 28.4 - ns
Turn-Off Fall Time
t
f
- 12.4 - ns
Reverse Recovery Time
t
r
r
- 14 - ns
I
F
= 12A, di/dt = 500A/s
Reverse Recovery Charge
Q
r
r
- 11 - nC
Notes: 4. AEC-Q101 V
GS
maximum is ±20V
5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to product testing.
DMP3050LSS
Document number: DS35647 Rev. 4 - 2
3 of 6
www.diodes.com
September 2012
© Diodes Incorporated
DMP3050LSS
NEW PRODUCT
0
5
10
15
20
0 0.5 1.0 1.5 2.0 2.5 3.0
-V , DRAIN -SOURCE VOLTAGE (V)
Fig. 1 Typical Output Characteristics
DS
-I , D
AI
E
(A)
D
V = -3.0V
GS
V = -3.5V
GS
V = -4.0V
GS
V = -4.5V
GS
V= -10V
GS
V = -5.0V
GS
V = -2.5V
GS
0
5
10
15
20
01 2345
-V , GATE-SOURCE VOLTAGE (V)
GS
Fig. 2 Typical Transfer Characteristics
-I , D
AI
E
(A)
D
T = 150C
A
°
T = 125C
A
°
T = 85C
A
°
T = 25C
A
°
T = -55C
A
°
V = -5.0V
DS
0
0.02
0.04
0.06
0.08
0.10
0.12
04812
16
20
-I , DRAIN SOURCE CURRENT (A)
Fig. 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
D
,D
AIN-S
U
CE
N-
ESISTANCE ( )
DS(ON)
Ω
0
0.02
0.04
0.06
0.08
0.10
345678910
-V , GATE SOURCE VOLTAGE (V)
GS
Fig. 4 Typical On-Resistance vs.
Drain Current and Gate Voltage
,D
AIN-S
U
CE
N-
ESISTANCE ( )
DS(ON)
Ω
0
0.02
0.04
0.06
0.08
0.10
0 5 10 15 20
-I , DRAIN SOURCE CURRENT (A)
Fig. 5 Typical On-Resistance vs.
Drain Current and Temperature
D
R
, D
R
AIN-S
O
U
R
CE
O
N-
R
ESISTANCE( )
DS(ON)
Ω
T = -55C
A
°
T = 25C
A
°
T = 85C
A
°
T = 125C
A
°
T = 150C
A
°
V= -4.5V
GS
-50 -25 0 25 50 75 100 125 150
T , JUNCTION TEMPERATURE ( C)
J
°
Fig. 6 On-Resistance Variation with Temperature
0.5
0.7
0.9
1.1
1.3
1.5
1.7
, D
AIN-S
E
ON-RESISTANCE (NORMALIZED)
DS(ON)

DMP3050LSS-13

Mfr. #:
Manufacturer:
Diodes Incorporated
Description:
MOSFET 30V P-CH MOSFET
Lifecycle:
New from this manufacturer.
Delivery:
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