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MCP73841T-410I/UN

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P26
2003-2013 Microchip Technology Inc. DS21823D-page 19
MCP73841/2/3/4
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
D
A
A1
L
c
(F)
α
A2
E1
E
p
B
n 1
2
φ
β
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
.037 REFFFootprint (Reference)
exceed .010" (0.254mm) per side.
Notes:
Drawing No. C04-111
*Controlling Parameter
Mold Draft Angle Top
Mold Draft Angle Bottom
Foot Angle
Lead Width
Lead Thickness
β
α
c
B
φ
.003
.009
.006
.012
Dimension Limits
Overall Height
Molded Package Thickness
Molded Package Width
Overall Length
Foot Length
Standoff
Overall Width
Number of Pins
Pitch
A
L
E1
D
A1
E
A2
.016 .024
.118 BSC
.118 BSC
.000
.030
.193 TYP.
.033
MIN
p
n
Units
.026 BSC
NOM
8
INCHES
0.95 REF
-
-
.009
.016
0.08
0.22
0°
0.23
0.40
8°
MILLIMETERS*
0.65 BSC
0.85
3.00 BSC
3.00 BSC
0.60
4.90 BSC
.043
.031
.037
.006
0.40
0.00
0.75
MIN
MAX NOM
1.10
0.80
0.15
0.95
MAX
8
--
-
15°5° -
15°5° -
JEDEC Equivalent: MO-187
0° - 8°
5°
5° -
-
15°
15°
--
-
-
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
MCP73841/2/3/4
DS21823D-page 20 2003-2013 Microchip Technology Inc.
10-Lead Plastic Micro Small Outline Package (UN) (MSOP)
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
.037 REFFFootprint
exceed .010" (0.254mm) per side.
Notes:
Drawing No. C04-021
*Controlling Parameter
Mold Draft Angle Top
Mold Draft Angle Bottom
Foot Angle
Lead Width
Lead Thickness
β
α
c
B
φ
.003
.006
-
.009
Dimension Limits
Overall Height
Molded Package Thickness
Molded Package Width
Overall Length
Foot Length
Standoff
Overall Width
Number of Pins
Pitch
A
L
E1
D
A1
E
A2
.016 .024
.118 BSC
.118 BSC
.000
.030
.193 BSC
.033
MIN
p
n
Units
.020 TYP
NOM
10
INCHES
0.95 REF
-
0.23
.009
.012
0.08
0.15
-
-
0.23
0.30
MILLIMETERS*
0.50 TYP.
0.85
3.00 BSC
3.00 BSC
0.60
4.90 BSC
.043
.031
.037
.006
0.40
0.00
0.75
MINMAX
NOM
1.10
0.80
0.15
0.95
MAX
10
5° 15°
5° 15°
-
--
0° - 8°
5° -
5° -
15°
15°
JEDEC Equivalent: MO-187
8°0°
E
L
D
β
(F)
B
p
E1
n
φ
α
A2
1
2
c
A1
A
L1
-
-
--
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
2003-2013 Microchip Technology Inc. DS21823D-page 21
MCP73841/2/3/4
8.0 REVISION HISTORY
Revision D (January 2013)
Added a note to each package outline drawing.
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P26

MCP73841T-410I/UN

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Buy MCP73841T-410I/UN
Manufacturer:
Microchip Technology
Description:
Battery Management w/ Ch Sfty & Temp Mn
Lifecycle:
New from this manufacturer.
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