MII145-12A3

MII145-12A3
67 ±0.2
M5
Ø 6.5
2.8 x0.5
30 ±0.3
0.25
7.5
5
7.7
+0.3
- 0.1
29.5
+0.5
- 0.2
General tolerances:
DIN ISO 2768-T1-m
34 ±0.2
15 ±0.2
Ø 12
18.5 ±0.15
94 ±0.3
80 ±0.2
M5 x10
17 ±0.2
40 ±0.2
63 ±0.2
28 ±0.15
89
10 11
4567
123
1
3
2
7
6
4
5
Outlines Y4
IXYS reserves the right to change limits, conditions and dimensions.
20131206aData according to IEC 60747and per semiconductor unless otherwise specified
© 2013 IXYS all rights reserved
MII145-12A3
0.5 1.0 1.5 2.0 2.5 3.0 3.5
0
50
100
150
200
250
0 200 400 600
0
5
10
15
20
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
0
50
100
150
200
250
6789101112
0
50
100
150
200
13 V
15 V
9V
V
CE
[V]
I
C
[A]
11 V
T
VJ
=25°C
V
GE
=17 V
Fig. 1 Typ. output characteristics
13 V
15 V
9V
11 V
V
GE
=17 V
T
VJ
=125°C
V
CE
[V]
I
C
[A]
Fig. 2 Typ. output characteristics
V
CE
=20V
T
VJ
=25°C
V
GE
[V]
I
C
[A]
Fig. 3 Typ. transfer characteristics
V
CE
=600V
I
C
=50A
Q
G
[nC]
V
GE
[V]
Fig. 4 Typ. turn-on gate charge
0 50 100 150 200
0
10
20
30
40
0
30
60
90
120
E
on
t
d(on)
t
r
E
on
[mJ]
t
[ns]
I
C
[A]
0 50 100 150 200
0
10
20
30
40
0
200
400
600
800
E
off
[mJ]
I
C
[A]
t
[ns]
E
off
t
f
t
d(off)
Fig.5Typ.turnonenergy&switching
timesversuscollectorcurrent
Fig.6 Typ. turn off energy & switching
times versus collector current
0 8 16 24 32 40 48 56
0
10
20
30
40
50
0
60
120
180
240
300
E
on
[mJ]
R
G
[]
E
on
t
d(on)
t
r
0 8 16 24 32 40 48 56
0
5
10
15
20
25
0
300
600
900
1200
1500
E
off
[mJ]
R
G
[]
E
off
t
d(off)
t
[ns]
t
[ns]
Fig.9 Typ.turnonenergy&switching
times versus gate resistor
Fig. 9 Typ. turn off energy & switching
times versus gate resistor
10
-4
10
-3
10
-2
10
-1
10
0
0.00
0.04
0.08
0.12
0.16
0.20
t[s]
Z
thJC
[K/W]
single pulse
Fig. 12 Typical transient
thermal impedance
V
CE
= 600 V
V
GE
15V
R
G
=6.8
T
VJ
=125°C
V
CE
=600V
V
GE
15V
R
G
=6.8
T
VJ
=125°C
V
CE
=600V
V
GE
15V
I
C
=100 A
T
VJ
= 125°C
V
CE
=600V
V
GE
15V
I
C
=100 A
T
VJ
=125°C
t
f
IGBT
IXYS reserves the right to change limits, conditions and dimensions.
20131206aData according to IEC 60747and per semiconductor unless otherwise specified
© 2013 IXYS all rights reserved
MII145-12A3
10
-3
10
-2
10
-1
10
0
0.0
0.1
0.2
0.3
0.4
0.5
0.5 1.0 1.5 2.0 2.5 3.0 3.5
0
50
100
150
200
250
300
V
F
[V]
I
F
[A]
T
J
=125°C
T
J
= 25°C
t[s]
Z
thJC
[K/W]
single pulse
Fig. 3 Typ. transient thermal impedance junction to case
Fig. 1 Typ. Forward current vs. V
F
Fig. 2 Typ. peak reverse current
I
RM
versus di/dt
0 200 400 600 800 1000
0
40
80
120
0
100
200
300
I
RM
t
rr
T
J
=125°C
V
R
= 600V
I
F
= 100A
-di/dt [A/μs]
I
RM
[A]
t
rr
[ns]
Diode
IXYS reserves the right to change limits, conditions and dimensions.
20131206aData according to IEC 60747and per semiconductor unless otherwise specified
© 2013 IXYS all rights reserved

MII145-12A3

Mfr. #:
Manufacturer:
Description:
MOD IGBT RBSOA 1200V 160A Y4-M5
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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