HMC213BMS8E Data Sheet
Rev. 0 | Page 20 of 21
APPLICATIONS INFORMATION
TYPICAL APPLICATION CIRCUIT
Figure 64 shows the typical application circuit for the
HMC213BMS8E. The HMC213BMS8E is a passive device and
does not require any external components. The LO and RF pins
are internally ac-coupled. The IF pin is internally dc-coupled.
When IF operation to dc is not required, use of an external
series capacitor of a value chosen to pass the necessary IF
frequency range is recommended. When IF operation to dc is
required, do not exceed the IF source and sink current rating
specified in the Absolute Maximum Ratings section.
LO
RF
GND
GND
IF
16439-001
1
2
3
4
8
7
6
5
HMC213B
Figure 64. Typical Application Circuit
EVALUATION PCB INFORMATION
Use RF circuit design techniques for the PCB. Ensure that signal
lines have 50 Ω impedance. Connect the package ground leads
directly to the ground plane (see Figure 65). Use a sufficient
number of via holes to connect the top and bottom ground
planes. The evaluation circuit board shown in Figure 65 is
available from Analog Devices, Inc., upon request.
Table 6. Bill of Materials
Item Description
J1, J2, J3 PCB mount SMA RF connectors
U1 HMC213BMS8E
PCB
1
101650-6 evaluation board on Rogers 4350
1
101650-6 is the raw bare PCB identifier. Reference EV1HMC213BMS8 when
ordering the complete evaluation PCB.
16439-067
Figure 65. Evaluation PCB Top Layer
