MP2488 – 2A, 200kHz, 55V HIGH-POWER LEDS DRIVER
MP2488 Rev. 1.0 www.MonolithicPower.com 2
6/20/2011 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2011 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number Package Top Marking Free Air Temperature (T
)
MP2488DQ*
QFN10(3x3mm)
7G
–40C to +85C
MP2488DN**
SOIC8E
MP2488DN
–40C to +85C
*For Tape & Reel, add suffix –Z (eg. MP2488DQ–Z);
For RoHS compliant packaging, add suffix –LF (eg. MP2488DQ–LF–Z)
**For Tape & Reel, add suffix –Z (eg. MP2488 DN–Z);
For RoHS compliant packaging, add suffix –LF (eg. MP2488 DN–LF–Z)
PACKAGE REFERENCE
TOP VIEW
SW
SW
EN
COMP
FB
1
2
3
4
5
BST
VIN
VIN
FREQ
GND
10
9
8
7
6
EXPOSED PAD
QFN10(3x3mm)
SW
EN
COMP
FB
BST
VIN
FREQ
GND
1
2
3
4
8
7
6
5
TOP VIEW
EXPOSED PAD
SOIC8E
ABSOLUTE MAXIMUM RATINGS
(1)
Supply Voltage (V
IN
) ..................... –0.3V to +60V
Switch Voltage (V
SW
) ............ –0.5V to V
IN
+ 0.5V
BST to SW ..................................... –0.3V to +5V
All Other Pins ................................. –0.3V to +5V
Junction Temperature ............................... 150C
Lead Temperature .................................... 260C
Storage Temperature .............. –65°C to +150C
Continuous Power Dissipation
(T
A
=+25C )
(2)
QFN10(3x3mm) ......................................... 2.5W
SOIC8 (Exposed Pad) ............................... 2.5W
Recommended Operating Conditions
(3)
Supply Voltage V
IN
........................... 4.5V to 55V
Maximum Junction Temp. (T
J
) ............... +125C
Thermal Resistance
(4)
θ
JA
θ
JC
QFN10(3x3mm) ...................... 50 ...... 12 ... C/W
SOIC8 (Exposed Pad) ............ 50 ...... 10 ... C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature T
J
(MAX), the junction-to-
ambient thermal resistance
JA
, and the ambient temperature
T
A
. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by P
D
(MAX)=(T
J
(MAX)-
T
A
)/
JA
. Exceeding the maximum allowable power dissipation
will cause excessive die temperature, and the regulator will go
into thermal shutdown. Internal thermal shutdown circuitry
protects the device from permanent damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7 4-layer board.
