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LT1534/LT1534-1
APPLICATIONS INFORMATION
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Thermal Considerations
Computing power dissipation for this IC requires careful
attention to detail. Reduced output slewing causes the part
to dissipate more power than would occur with fast edges.
However, much improvement in noise can be produced
with modest decrease in supply efficiency.
Power dissipation is a function of topology, input voltage,
switch current and slew rates. It is impractical to come up
with an all-encompassing formula. It is therefore recom-
mended that package temperature be measured in each
application. The part has an internal thermal shutdown to
prevent device destruction, but this should not replace
careful thermal design.
1. Dissipation due to input current:
PVmA
I
VIN IN
=+
11
60
where I is the average switch current.
2. Dissipation due to the driver saturation:
P
VSAT
= (V
SAT
)(I)(DC
MAX
)
where V
SAT
is the output saturation voltage which is
approximately 0.1 + (0.2)(I), DC
MAX
is the maximum
duty cycle.
3. Dissipation due to output slew using approximations
for slew rates:
P
VI
I
R
IV
V
Rf
SLEW
IN
CSL
IN
SAT
VSL OSC
=
()
+
()
()
+
()
()
()
()
2
2
9
2
2
9
4
33 10
4
220 10
Note if V
SAT
and I are small with respect to V
IN
and I,
then:
P
IR
V
R
fVI
SLEW
CSL
IN
VSL
OSC IN
=
()( )
()
+
()
()
()
()()()
33 10 220 10
99
One word of caution. Sometimes a feedback zero is added
to the control loop by placing a capacitor across R1 above.
If the feedback zero capacitively pulls the FB pin above the
internal regulator voltage (2.4V typ), output regulation
may be disrupted. A series resistance with the feedback
pin can eliminate this potential problem.
Negative Output Voltage Setting
Negative output voltage can be sensed using the NFB pin.
In this case regulation will occur when the NFB pin is at
2.5V. The input bias current for the NFB pin is –25µA
(I
NFB
) and must be accounted for when selecting divider
resistor values.
Figure 3
NFB PIN
I
NFB
1534 F02
–V
OUT
R2
R1
Referring to Figure 3, R1 is chosen such that:
RR
V
RA
OUT
12
25
25 2 25
=
.
.•
A suggested value for R2 is 2.5k. The NFB pin is normally
left open if the FB pin is being used.
Dual Polarity Output Voltage Sensing
Certain applications may benefit from sensing both posi-
tive and negative output voltages. When doing this each
output voltage resistor divider is individually set as previ-
ously described. When both FB and NFB pins are used, the
LT1534 will act to prevent either output from going
beyond its set output voltage. The highest output (lightest
load) will dominate control of the regulator. This technique
would prevent either output from going unregulated high
at no load. However, this technique will also compromise
output load regulation.
Shutdown
If the shutdown pin is pulled low, the regulator will turn off.
The supply current will be reduced to less than 20µA.
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LT1534/LT1534-1
APPLICATIONS INFORMATION
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where I is the ripple current in the switch, R
CSL
and
R
VSL
are the slew resistors and f
OSC
is the oscillator
frequency.
Power dissipation P
D
is the sum of these three terms. Die
junction temperature is then computed as:
T
J
= T
AMB
+ (P
D
)(θ
JA
)
where T
AMB
is ambient temperature and θ
JA
is the package
thermal resistance. For the 16-pin SO with fused leads the
θ
JA
is 50°C/W.
For example, with f
OSC
= 40kHz, 0.4A average current and
0.1A of ripple, the maximum duty cycle is 88%. Assume
slew resistors are both 17k and V
SAT
is 0.26V, then:
P
D
= 0.176W + 0.094W + 0.158W = 0.429W
In an S16 fused lead package the die junction temperature
would be 21°C above ambient.
Frequency Compensation
Loop frequency compensation is accomplished by way of
a series RC network on the output of the error amplifier (V
C
pin). Referring to Figure 4, the main pole is formed by
capacitor C
VC
and the output impedance of the error
amplifier (approximately 400k). The series resistor R
VC
creates a “zero” which improves loop stability and tran-
sient response. A second capacitor C
VC2
, typically one-
tenth the size of the main compensation capacitor, is
sometimes used to reduce the switching frequency ripple
on the V
C
pin. V
C
pin ripple is caused by output voltage
ripple attenuated by the output divider and multiplied by
the error amplifier. Without the second capacitor, V
C
pin
ripple is:
V
VgR
V
CPIN RIPPLE
RIPPLE m VC
OUT
=
()( )()()
125.
where V
RIPPLE
= Output ripple (V
P-P
)
g
m
= Error amplifier transconductance
R
VC
= Series resistor on V
C
pin
V
OUT
= DC output voltage
To prevent irregular switching, V
C
pin ripple should be
kept below 50mV
P-P
. Worst-case V
C
pin ripple occurs at
maximum output load current and will also be increased if
poor quality (high ESR) output capacitors are used. The
addition of a 0.0047µF capacitor on the V
C
pin reduces
switching frequency ripple to only a few millivolts. A low
value for R
VC
will also reduce V
C
pin ripple, but loop phase
margin may be inadequate.
Capacitors
While the IC reduces the source of switcher noise, it is
essential for the lowest noise, that the filter capacitors
should have low parasitic impedance. Sanyo OS-CON,
Panasonic Specialty Polymer and tantalum capacitors are
the preferred types. Aluminum electrolytics are not suit-
able for this application. In general, ESR is more critical
than capacitance. At higher frequencies, ESL can also be
important. Paralleling capacitors can reduce both ESR and
ESL.
Design Note 95 offers more information about capacitor
selection. The following is a brief summary:
Solid tantalum capacitors have small size and low
impedance. Typically they are available for voltages
below 50V. They may have a problem with surge
currents (AVX TPS line addresses this issue).
OS-CON capacitors have very low impedance but are
only available for 25V or less. Form factor may be a
problem. Sometimes their very low ESR can cause loop
stability problems.
Ceramic capacitors are generally used for high fre-
quency and high voltage bypass. They too can have
such a low ESR as to cause loop stability problems.
Often they can resonate with their ESL before ESR
becomes effective.
Specialty Polymer Aluminum: Panasonic has come out
with their series CD capacitors. While they are only
available for voltages below 16V, they have very low
ESR and good surge capability.
V
C
PIN
1534 F03
R
VC
2k
C
VC
0.01µF
C
VC2
4.7nF
Figure 4
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LT1534/LT1534-1
APPLICATIONS INFORMATION
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Fast Voltage Slew Edges
A very fast voltage slew under certain operating conditions
may produce ringing on the COL voltage waveform. While
there is small harmonic energy in this, it can be eliminated
by placing an RC network of 10 in series with 1000pF
from the COL pin to ground.
Switching Diodes
In general, switching diodes should be Schottky diodes
such as 1N5817-19 or MBR320-330.
Choosing the Inductor
For a boost converter, inductor selection involves trade-
offs of size, maximum output power, transient response
and filtering characteristics. Higher inductor values pro-
vide more output power and lower input ripple. However,
they are physically larger and can impede transient re-
sponse. Low inductor values have high magnetizing cur-
rent, which can reduce maximum power and increase
input current ripple.
The following procedure can be used to handle these
trade-offs:
1. Assume that the average inductor current for a boost
converter is equal to load current times V
OUT
/V
IN
and
decide whether the inductor must withstand continu-
ous overload conditions. If average inductor current at
maximum load current is 0.5A, for instance, a 0.5A
inductor may not survive a continuous 1.5A overload
condition. Also be aware that boost converters are not
short-circuit protected, and under output short condi-
tions, only the available current of the input supply
limits inductor current.
Input Capacitor
The ESR of this capacitor acts with high frequency current
components to produce much of the conducted noise of
the switcher. Values of 1µF to 47µF are typical with ESR
less than 0.3. Place the capacitor close to the IC and
inductor.
The input capacitor can see a high surge current when a
battery of high capacitance source is connected “live.”
Some solid tantalum capacitors can fail under this con-
dition. Several manufacturers have developed a line of
solid tantalum capacitors specially tested for surge capa-
bility (e.g., AVX TPS series). However, even these units
may fail if the input voltage approaches the maximum
voltage rating of the capacitor. AVX recommends derat-
ing capacitor voltage by 2:1 for high surge applications.
Output Filter Capacitor
Output capacitors are usually chosen on the basis of ESR
since this will determine output ripple. However, low ESR
is also needed for low output noise and this will typically
be the tougher requirement. Typically required ESR will be
less than 0.2 . Typical capacitance values are in the 47µF
to 500µF range. Again keep connection length as short as
possible. Table 1 shows some typical surface mount
capacitors.
Table 1
SIZE CAPACITOR ESR (MAX )
E CASE AVX TPS, Sprague 593D 0.1 to 0.3
AVX TAJ 0.7 to 0.9
D CASE AVX TPS, Sprague 593D 0.1 to 0.3
AVX TAJ 0.9 to 2.0
Panasonic CD 0.05 to 0.18
C CASE AVX TPS 0.2 (Typ)
AVX TAJ 1.8 to 3.0
B CASE AVX TAJ 2.5 to 10

LT1534CS-1#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators Ultralow N 2A Sw Reg
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