Reliability Test
Drop Test
No mechanical damage
Inductance change to be within ±20% to the initial.
Random Free Fall test on concrete plate.
1 meter, 10 drops
Terminal Adhesion Test
No indication of peeling shall occur on the
terminal electrode.
W(kgf) TIME(sec)
0.5 10±1
Vibration Test
No mechanical damage
Inductance change to be within ±20% to the initial.
Solder the sample on PCB. Vibrate as apply 10~55Hz, 1.5mm
amplitude for 2 hours in each of three(X,Y,Z) axis (total 6 hours).
Bending Test
No mechanical damage
Bending Limit; 2mm
Test Speed; 1.0mm/sec.
Keep the test board at the limit point in 5 sec.
PCB thickness : 1.6mm
High Temperature Loading Test
No mechanical damage
Inductance change to be within ±20% to the initial
85±2℃, Rated Current for 500±12 hours.
Measure the test items after leaving at normal temperature and
humidity for 24 hours.
Reflow Test
No mechanical damage
Inductance change to be within ±20% to the initial
Peak 260±5℃, 3 times
High Temperature Test
No mechanical damage
Inductance change to be within ±20% to the initial.
Solder the sample on PCB. Exposure at 125±2℃ for 500±12
hours.
Measure the test items after leaving at normal temperature and
humidity for 24hours.
High Temp. Humidity Resistance
Loading Test
No mechanical damage
Inductance change to be within ±20% to the initial
85±2℃, 85%RH, Rated Current for 500±12 hours.
Measure the test items after leaving at normal temperature and
humidity for 24 hours.
High Temp. Humidity
Resistance Test
No mechanical damage
Inductance change to be within ±20% to the initial
85±2℃, 85%RH, for 500±12 hours.
Measure the test items after leaving at normal temperature and
humidity for 24 hours.
Low Temperature Test
No mechanical damage
Inductance change to be within ±20% to the initial.
Solder the sample on PCB. Exposure
at -55±2℃ for 500±12 hours.
Measure the test items after leaving at normal temperature and
humidity for 24hours.
Resistance to Soldering
No mechanical damage.
Remaining terminal Electrode: 75% min.
Inductance change to be within ±20% to the initial.
After being dipped in flux for 4±1 seconds, and preheated at
150∼180℃ for 2∼3 min, the specimen shall be immersed in
solder at 260±5℃ for 10 ±0.5 seconds.
Thermal Shock
(Temperature Cycle test)
No mechanical damage
Inductance change to be within ±20% to the initial.
Repeat 100 cycles under the following conditions.
-40±3℃ for 30 min → 85±3℃ for 30 min
Item Specified Value Test Condition
Solderability
More than 90% of terminal electrode should be
soldered newly.
After being dipped in flux for 4±1 seconds, and preheated at
150∼180℃ for 2∼3 min, the specimen shall be immersed in
solder at 245±5℃ for 4±1 seconds.
