© 2015 International Rectifier
Absolute Maximum Ratings
Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All
voltage parameters are absolute voltages referenced to COM; all currents are defined positive into any lead.
The Thermal Resistance and Power Dissipation ratings are measured under board mounted and still air
conditions.
Symbol Definition Min. Max. Units
VHV
High Voltage Input
†
-0.3 450
V
VOUT Low-Side Output Voltage -0.3
V
CC
+ 0.3
V
ADIM
DIM Input Voltage -0.3
V
CC
+ 0.3
V
RAMP Input Voltage -0.3
V
+ 0.3
I
CC
Supply Current
--- 20
mA
IO
MAX
Maximum allowable current at OUT due to external
power transistor Miller effect.
-500 500
P
D
Maximum Power Dissipation @ T
A
≤ +25ºC
--- 0.625 W
R
θJA
Thermal Resistance, Junction to Ambient --- 128 ºC/W
T
J
Junction Temperature -55 150
ºC
T
S
Storage Temperature -55 150
T
L
Lead Temperature (Soldering, 10 seconds) --- 300
†
The IRS2980S uses an HVIC process capable of withstanding up to 600V, however the internal
regulator maximum input voltage rating is limited to 450V maximum due to package power
dissipation. The device can withstand transient voltages up to 600V for short periods.
††
This IC contains a zener clamp structure between the chip VCC and COM which has a nominal
breakdown voltage of 15.6V. This supply pin should not be driven by a DC, low impedance power
source greater than the V
CLAMP
specified in the Electrical Characteristics section.
††† Power dissipation is dependent on VHV and switching frequency. In order to limit device
temperature rise some thermal relief may be required in the form of copper on the PCB located
under and around the device. Alternatively a small heat sink may be attached to the top of the
device. Thermally conductive potting compounds can also provide excellent heat transfer.
