HMC424A

For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
ATTENUATORS - DIGITAL - CHIP
4
HMC424A
v01.1115
0.5dB LSB GaAs MMIC 6-BIT DIGITAL
ATTENUATOR, DC - 13 GHz
Truth Table
Control Voltage Bias Voltage & Current
Absolute Maximum Ratings
Control Voltage Input
Attenuation
State
RF1 - RF2
V1
16 dB
V2
8 dB
V3
4 dB
V4
2 dB
V5
1 dB
V6
0.5 dB
Low Low Low Low Low Low
Reference
I.L.
Low Low Low Low Low High 0.5 dB
Low Low Low Low High Low 1 dB
Low Low Low High Low Low 2 dB
Low Low High Low Low Low 4 dB
Low High Low Low Low Low 8 dB
High Low Low Low Low Low 16 dB
High High High High High High 31.5 dB
Any Combination of the above states will provide
an attenuation approximately equal to the sum of
the bits selected.
State Vee = +3V Vee = +5V
Low 0 to -1V @ 45 µA Typ 0 to -3V @ 45 µA Typ.
High -3V to -2.2V @ 1 µA Typ. -5V to -4.2V @ 1 µA Typ
Vee Range= -5 Vdc ± 10%
Vee
(Vdc)
Iee (Typ.)
(mA)
Iee (Max.)
(mA)
-3 2.7 5
-5 2.8 5
Control Voltage (V1 to V6) Vee - 0.5 Vdc
Bias Voltage (Vee) -7 Vdc
Channel Temperature 150 °C
Thermal Resistance 330 °C/W
Storage Temperature -65 to + 150 °C
Operating Temperature -55 to +85 °C
RF Input Power (0.5 - 13 GHz) +25 dBm
ESD Sensitivity (HBM) Class 1A
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Die Packaging Information
[1]
Standard Alternate
WP-8 (Waffle Pack) [2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
ATTENUATORS - DIGITAL - CHIP
5
HMC424A
v01.1115
0.5dB LSB GaAs MMIC 6-BIT DIGITAL
ATTENUATOR, DC - 13 GHz
Outline Drawing
1. ALL DIMENSIONS ARE IN INCHES (MILLIMETERS).
2. TYPICAL BOND PAD IS .004” SQUARE.
3. TYPICAL BOND PAD SPACING IS .006”
CENTER TO CENTER EXCEPT AS NOTED.
4. BACKSIDE METALIZATION: GOLD
5. BACKSIDE METAL IS GROUND
6. BOND PAD METALIZATION: GOLD
Pad Number Function Description Interface Schematic
GND Die bottom must be connected to RF ground.
1, 3 RF1, RF2
This pad is DC coupled and matched to 50 Ohm. Blocking
capacitors are required if RF line potential is not equal to 0V.
2 VEE Supply Voltage -5V ± 10%
4, 5, 6, 7, 8, 9 V1 - V6 See truth table and control voltage table.
Pad Descriptions
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
ATTENUATORS - DIGITAL - CHIP
6
HMC424A
v01.1115
0.5dB LSB GaAs MMIC 6-BIT DIGITAL
ATTENUATOR, DC - 13 GHz
Suggested Driver Circuit (One Circuit Required Per Bit Control Input)
Simple driver using inexpensive standard logic ICs provides fast switching using minimum DC current.
* Recommended value to suppress unwanted RF signals at V1 - V6 control lines.
Assembly Diagram

HMC424A

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Attenuators 5 dB LSB 6-Bit Digital Attenuator SMT
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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