Accu-P
®
Application Notes
PREHEAT & SOLDERING
The rate of preheat in production should not exceed 4°C/
second and a recommended maximum is about 2°C/second.
Temperature differential from preheat to soldering should not
exceed 100°C.
For further specific application or process advice, please consult
AVX.
COOLING
After soldering, the assembly should preferably be allowed
to cool naturally. In the event of assisted cooling, similar
conditions to those recommended for preheating should be
used.
HAND SOLDERING & REWORK
Hand soldering is permissible. Preheat of the PCB to 150°C is
required. The most preferable technique is to use hot air sol-
dering tools. Where a soldering iron is used, a temperature
controlled model not exceeding 30 watts should be used and
set to not more than 260°C.
CLEANING RECOMMENDATIONS
Care should be taken to ensure that the devices are
thoroughly cleaned of flux residues, especially the space
beneath the device. Such residues may otherwise become
conductive and effectively offer a lossy bypass to the device.
Various recommended cleaning conditions (which must be
optimized for the flux system being used) are as follows:
Cleaning liquids. . . . . . . i-propanol, ethanol, acetylacetone,
water and other standard PCB
cleaning liquids.
Ultrasonic conditions . . power-20w/liter max.
frequency-20kHz to 45kHz.
Temperature . . . . . . . . . 80°C maximum (if not otherwise
limited by chosen solvent system).
Time . . . . . . . . . . . . . . . 5 minutes max.
STORAGE CONDITIONS
Recommended storage conditions for Accu-P
®
prior to use
are as follows:
Temperature . . . . . . . . . . 15°C to 35°C
Humidity . . . . . . . . . . . . . ≤65%
Air Pressure . . . . . . . . . . 860mbar to 1060mbar
220
210
200
190
180
170
160
150
140
130
120
110
100
90
80
70
60
50
40
30
20
00.511.522.533.544.5
Assembly enters the
preheat zone
Additional soak time
to allow uniform
heating of the
substrate
Soak time
1) Activates the flux
2) Allows center of board
temperatures to catch up with
corners
45-60 sec.
above solder
melting point
Assembly exits heat–
no forced cooldown
186°C solder melting
temperature
COMPONENT LAND TEMP (DEG C)
Time (mins)
1
29
RECOMMENDED REFLOW
SOLDERING PROFILE
COMPONENTS WITH
SnPb TERMINATIONS
330
260
250
200
150
100
50
0
Temp (ºC)
Time
0:00 0:43 1:28 2:10 2:53 3:36 4:19 5:02 5:48 6:29
Peak Temperature = 260ºC
RECOMMENDED REFLOW
SOLDERING PROFILE
LEAD FREE
COMPONENTS WITH
Sn100 TERMINATIONS
