04023J0R9BBSTR Datasheet 06033J1R5BBTTR, 12105J0R7ABTTR, 04023J0R4QBWTR | P22-P24

Accu-P

Environmental / Mechanical Characteristics

QUALITY & RELIABILITY

Accu-P

is based on well established thin-film technology

and materials.

• ON-LINE PROCESS CONTROL

This program forms an integral part of the production cycle

and acts as a feedback system to regulate and control

production processes. The test procedures, which are

integrated into the production process, were developed

after long research work and are based on the highly

developed semiconductor industry test procedures and

equipment. These measures help AVX to produce a con-

sistent and high yield line of products.

• FINAL QUALITY INSPECTION

Finished parts are tested for standard electrical parameters

and visual/mechanical characteristics. Each production lot

is 100% evaluated for: capacitance and proof voltage at

2.5 U

. In addition, production is periodically evaluated for:

Average capacitance with histogram printout for

capacitance distribution;

IR and Breakdown Voltage distribution;

Temperature Coefficient;

Solderability;

Dimensional, mechanical and temperature stability.

QUALITY ASSURANCE

The reliability of these thin-film chip capacitors has been

studied intensively for several years. Various measures

have been taken to obtain the high reliability required today

by the industry. Quality assurance policy is based on well

established international industry standards. The reliability

of the capacitors is determined by accelerated testing

under the following conditions:

Life (Endurance) 125°C, 2U

, 1000 hours

Accelerated Damp

Heat Steady State 85°C, 85% RH, U

1000 hours.

TEST CONDITIONS REQUIREMENT

Life (Endurance)

125°C, 2U

,1000 hours No visible damage

MIL-STD-202F Method 108A

Δ C/C ≤ 2% for C≥5pF

Δ C ≤ 0.25pF for C<5pF

Accelerated Damp

85°C, 85% RH, U

, 1000 hours No visible damage

Heat Steady State

Δ C/C ≤ 2% for C≥5pF

MIL-STD-202F Method 103B

Δ C ≤ 0.25pF for C<5pF

Temperature Cycling

-55°C to +125°C, 15 cycles – Accu-P

No visible damage

MIL-STD-202F Method 107E

Δ C/C ≤ 2% for C≥5pF

MIL-STD-883D Method 1010.7

Δ C ≤ 0.25pF for C<5pF

Resistance to Solder Heat

260°C ± 5°C for 10 secs C remains within initial limits

IEC-68-2-58

ENVIRONMENTAL CHARACTERISTICS

TEST CONDITIONS REQUIREMENT

Solderability

Components completely immersed in a Terminations to be well tinned, minimum 95%

IEC-68-2-58

solder bath at 235°C for 2 secs. coverage

Leach Resistance

Components completely immersed in a

Dissolution of termination faces ≤15% of area

IEC-68-2-58

solder bath at 260±5°C for 60 secs.

Dissolution of termination edges ≤25% of length

Adhesion

A force of 5N applied for 10 secs. No visible damage

MIL-STD-202F Method 211A

Termination Bond Strength

Tested as shown in diagram No visible damage

IEC-68-2-21 Amend. 2

Δ C/C ≤ 2% for C≥5pF

Δ C ≤ 0.25pF for C<5pF

Robustness of Termination

A force of 5N applied for 10 secs. No visible damage

IEC-68-2-21 Amend. 2

High Frequency Vibration

55Hz to 2000Hz, 20G No visible damage

MIL-STD-202F Method 201A,

204D

(Accu-P

only)

Storage

12 months minimum with components Good solderability

stored in “as received” packaging

MECHANICAL CHARACTERISTICS

45mm 45mm

D = 3mm Accu-P

D = 1mm Accu-F

CAPACITOR TYPE CHIP SIZE THERMAL IMPEDANCE (°C/W)

Accu-P

0805 6.5

1210 5

Microwave MLC 0505 12

1210 7.5

ADVANTAGES OF ACCU-P

IN RF POWER CIRCUITS

The optimized design of Accu-P

offers the designer of RF

power circuits the following advantages:

• Reduced power losses due to the inherently low ESR of

Accu-P

• Increased power dissipation due to the high thermal

conductivity of Accu-P

PRACTICAL APPLICATION

IN RF POWER CIRCUITS

• There is a wide variety of different experimental methods

for measuring the power handling performance of a

capacitor in RF power circuits. Each method has its

own problems and few of them exactly reproduce the

conditions present in “real” circuit applications.

• Similarly, there is a very wide range of different circuit appli-

cations, all with their unique characteristics and operating

conditions which cannot possibly be covered by such

“theoretical” testing.

• THE ONLY TRUE TEST OF A CAPACITOR IN ANY PARTICULAR

APPLICATION IS ITS PERFORMANCE UNDER OPERATING

CONDITIONS IN THE ACTUAL CIRCUIT.

Accu-P

Performance Characteristics RF Power Applications

RF POWER APPLICATIONS

In RF power applications capacitor losses generate heat. Two

factors of particular importance to designers are:

• Minimizing the generation of heat.

• Dissipating heat as efficiently as possible.

CAPACITOR HEATING

• The major source of heat generation in a capacitor in RF

power applications is a function of RF current (I) and ESR,

from the relationship:

Power dissipation = I

RMS

x ESR

• Accu-P

capacitors are specially designed to minimize

ESR and therefore RF heating. Values of ESR for

Accu-P

capacitors are significantly less than those of

ceramic MLC components currently available.

HEAT DISSIPATION

• Heat is dissipated from a capacitor through a variety of

paths, but the key factor in the removal of heat is the

thermal conductivity of the capacitor material.

• The higher the thermal conductivity of the capacitor, the

more rapidly heat will be dissipated.

• The table below illustrates the importance of thermal

conductivity to the performance of Accu-P

in power

applications.

1210

0805

Amps

0 200 400 600 800 1000 1200 1400MHz

1210

0805

0603

0402

PRODUCT MATERIAL THERMAL CONDUCTIVITY W/mK

Accu-P

Alumina 18.9

Microwave MLC Magnesium Titanate 6.0

Power Handling

Accu-P

10pF

Data used in calculating the graph:

Thermal impedance of capacitors:

0402 17°C/W

0603 12°C/W

0805 6.5°C/W

1210 5°C/W

Thermal impedance measured using RF generator,

amplifier and strip-line transformer.

ESR of capacitors measured on Boonton 34A

THERMAL IMPEDANCE

Thermal impedance of Accu-P

chips is shown below com-

pared with the thermal impedance of Microwave MLC’s.

The thermal impedance expresses the temperature difference

in °C between chip center and termination caused by

a power dissipation of 1 watt in the chip. It is expressed in

°C/W.

1.7

(0.068)

0.55

(0.022)

0.5

(0.020)

0.6

(0.024)

0.6

(0.024)

3.0

(0.118)

1.25 (0.049)

1.0

(0.039)

0.17

(0.007)

0.20

(0.008)

0.22

(0.009)

0.78

(0.030)

0.34

(0.013)

0.26

(-0.010)

0.26

(-0.010)

0.26

(-0.010)

1.0

(0.039)

1.0

(0.039)

4.0

(0.157)

1.0

(0.039)

2.5 (0.098)

2.0

(0.079)

1.0

(0.039)

0.8 (0.031)

2.3

(0.091)

0.6

(0.024)

0.85

(0.033)

0.85

(0.033)

Accu-P

Application Notes

GENERAL

Accu-P

SMD capacitors are designed for soldering to printed

circuit boards or other substrates. The construction of the

components is such that they will withstand the time/temper-

ature profiles used in both wave and reflow soldering meth-

ods.

CIRCUIT BOARD TYPE

The circuit board types which may be used with Accu-P

are

as follows:

All flexible types of circuit boards

(eg. FR-4, G-10) and also alumina.

For other circuit board materials, please consult factory.

HANDLING

SMD capacitors should be handled with care to avoid damage

or contamination from perspiration and skin oils. The use of

plastic tipped tweezers or vacuum pick-ups is strongly recom-

mended for individual components. Bulk handling should

ensure that abrasion and mechanical shock are minimized. For

automatic equipment, taped and reeled product gives the

ideal medium for direct presentation to the placement

machine.

COMPONENT PAD DESIGN

Component pads must be designed to achieve good

joints

and minimize component movement during reflow

soldering. Pad designs are given below for both wave and

reflow soldering.

The basis of these designs is:

a. Pad width equal to component width. It is permissible to

decrease this to as low as 85% of component width but

it is not advisable to go below this.

b. Pad overlap 0.5mm beneath large components. Pad

overlap about 0.3mm beneath small components.

c. Pad extension of 0.5mm for reflow of large components

and pad extension about 0.3mm for reflow of small com-

ponents. Pad extension about 1.0mm for wave soldering.

REFLOW SOLDERING

PAD DIMENSIONS: millimeters (inches)

0402

Accu-P

0201

Accu-P

01005

Accu-P

0603

Accu-P

0805

Accu-P

1210

Accu-P

P1-P3 P4-P6 P7-P9 P10-P12 P13-P15 P16-P18 P19-P21 P22-P24 P25-P26

04023J0R9BBSTR

Mfr. #:

Buy 04023J0R9BBSTR

Manufacturer:

N/A

Description:

Film Capacitors 25volts 0.9pF

Lifecycle:

New from this manufacturer.

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04023J0R9BBSTR

04023J0R9BBSTR

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