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IRLR8259TRPBF
P1-P3
P4-P6
P7-P9
P10-P11
IRLR/U8259PbF
www.irf.com
7
Fig 15.
Peak
Diode Recovery
dv/dt Test
Circuit
for N-Channel
HEXFET
®
Power MOSFETs
Circuit
Layout
Considerations
•
Low Stray Inductance
•
Ground Plane
•
Low Leakage Inductance
Current Transformer
P.W.
Period
di/dt
Diode Recovery
dv/dt
Ripple
≤
5%
Body Diode
Forward Drop
Re-Applied
Voltage
Reverse
Recovery
Current
Body Diode Forward
Current
V
GS
=10V
V
DD
I
SD
Driver Gate Drive
D.U.T
. I
SD
Waveform
D.U.T
. V
DS
Waveform
Inductor Curent
D =
P. W .
Period
*
V
GS
=
5V for Logic
Level Devices
*
+
-
+
+
+
-
-
-
R
G
V
DD
•
dv/dt controlled by
R
G
•
Driver same type as
D.U.T.
•
I
SD
controlled
by Duty Factor
"D"
•
D.U.T. - Device
Under Test
D.U.T
Fig 16.
Gate Charge Waveform
Vds
Vgs
Id
Vgs(th
)
Qgs
1
Qgs
2
Qgd
Qgodr
IRLR/U8259PbF
8
www.irf.com
D-Pak
(TO-252AA)
Part
Marking
Information
D-Pak
(TO-252AA)
Package
Outline
Dimensions
are
shown
in
millimeters
(inches)
Note: For the most current drawing please refer to IR website at
http://www.irf.com/package/
IRLR/U8259PbF
www.irf.com
9
I-Pak
(TO-251AA)
Package
Outline
Dimensions
are
shown
in
millimeters
(inches)
I-Pak
(TO-251AA)
Part
Marking
Information
25
Note: For the most current drawing please refer to IR website at
http://www.irf.com/package/
P1-P3
P4-P6
P7-P9
P10-P11
IRLR8259TRPBF
Mfr. #:
Buy IRLR8259TRPBF
Manufacturer:
Infineon Technologies
Description:
MOSFET MOSFT 25V 57A 8.7mOhm 6.8nC LogLvl
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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