24-7068-6401

331 Organic Cored Wire for Lead-Free

and Leaded Alloys

Product Description

Kester 331 organic ux is a water-soluble formula for use in ux-cored solder wire. This cored solder version of the

popular 2331-ZX Neutral Organic Water Soluble Liquid Flux is more effective than rosin uxes in soldering difcult metals.

The same fast action and mild properties are exhibited with 331 Organic Flux as with the liquid 2331-ZX. The ux is more

heat stable than most organic uxes, resulting in minimal smoke and odor. The residue can be completely removed with

a simple heated water rinse. Deionized water is suggested to prevent introduction of chemistries from unknown water

sources.

Tested to J-STD-004, IPC-TM-650, Method

2.6.15

RoHS Compliance

Kester does not determine any applicable Restriction of Hazardous Substances (RoHS) exemptions for our lead

containing products at the user level. (Applies only if this core ux is combined with a lead-free alloy)

Silver Chromate: Fail

Tested to J-STD-004, IPC-TM-650, Method

2.3.33

Chloride and Bromides: 1.2%

Tested to J-STD-004, IPC-TM-650, Method

Fluorides by Spot Test: Pass

Tested to J-STD-004, IPC-TM-650, Method

(typical): Pass

10

Day 4 2.2*10

10

Day 7 1.7*10

10

Performance Characteristics:

■ Excellent solderability to a wide

■ Easy removal in hot DI water

■ Compatible with leaded and lead-

(SDS) and warning label before using this product.

Storage and Shelf Life

Storage must be in a dry, non-corrosive environment. The surface may lose its shine and appear a dull shade of gray.

This is a surface phenomena and is not detrimental to product functionality. Flux cored solder wire has a limited shelf life

determined by the alloy used in the wire. For alloys containing more than 70% lead, the shelf life is two years from the

date of manufacture. Other alloys have a shelf life of three years from the date of manufacture.

Cleaning

The 331 ux residue is conductive and will cause corrosion of metal parts over time. Residue removal should be

completed within 48 hours. 331 Organic Flux has the advantage over many competitive water-soluble ux formulations

in that the residue is easily and completely removed with plain hot water (120°F-140°F degrees). Softened tap water

are available.

Note: Core size 50, 58 and 66 = 1.1%, 2.2% and 3.3% ux core.

Process Considerations

Solder iron tip temperatures are most commonly between 315-343°C (600-650°F) for Sn63Pb37 and Sn62Pb36Ag02

alloys, and 371-400°C (700-750°F) for lead-free alloys. Heat both the land area and component lead to be soldered with

the iron prior to touching the land with the cored wire. Do not apply the wire directly to the soldering iron tip. If needed,

Kester 2331-ZX organic ux may be used as a compatible liquid ux to aid in reworking soldered joints. Kester 2331-ZX is

available in Flux-Pens.