© Semiconductor Components Industries, LLC, 2009
August, 2009 − Rev. 4
1 Publication Order Number:
NUF6105FC/D
NUF6105FC
6-Channel EMI Filter with
Integrated ESD Protection
The NUF6105FC is a six−channel (C−R−C) Pi−style EMI filter
array with integrated ESD protection. Its typical component values of
R = 100 and C = 27 pF deliver a cutoff frequency of 100 MHz and
stop band attenuation greater than −35 dB from 800 MHz to 2.2 GHz.
This performance makes the part ideal for parallel interfaces with
data rates up to 67 Mbps in applications where wireless interference
must be minimized. The specified attenuation range is very effective
in minimizing interference from 2G/3G, GPS, Bluetooth® and
WLAN signals.
The NUF6105FC is available in the low−profile 12−lead 2.9 mm x
1.3 mm Flip−Chip surface mount package.
Features/Benefits
• ±30 kV ESD Protection on each channel (IEC61000−4−2 Level 4,
Contact Discharge)
• ±16 kV ESD Protection on each channel (Human Body Model)
• R/C Values of 100 and 27 pF deliver Exceptional S21 Performance
Characteristics of 100 MHz f
3dB
and −35 dB Stop Band Attenuation
from 800 MHz to 2.2 GHz
• Integrated EMI/ESD System Solution in Flip−Chip Package Offers
Exceptional Cost, System Reliability and Space Savings
• Pb−Free Package is Available*
Applications
• EMI Filtering for LCD and Camera Data Lines
• EMI Filtering and Protection for I/O Ports and Keypads
Figure 1. Electrical Schematic
See Table 1 for pin description
C
d
= 27 pF C
d
= 27 pF
R = 100
Filter + ESD
n
Filter + ESD
n
−50
−45
−40
−35
−30
−25
−20
−15
−10
−5
0
10 100 1000 10000
Figure 1. Insertion Loss Curve
(S21 Measurement)
FREQUENCY (MHz)
S21 (dB)
Channel 1 or Channel 6
Channel 2 or Channel 5
Channel 3
or Channel 4
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Device Package Shipping
†
ORDERING INFORMATION
NUF6105FCT1 Flip−Chip 3000/Tape & Reel
http://onsemi.com
FLIP−CHIP
CASE 499D
PLASTIC
A1
NUF6105AYWWG
G
MARKING DIAGRAM
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
NUF6105FCT1G Flip−Chip
(Pb−Free)
3000/Tape & Reel
