TC6501/2/3/4
DS21451E-page 10 2002-2012 Microchip Technology Inc.
5-Lead Plastic Small Outline Transistor (CT) (SOT-23)
10501050
Mold Draft Angle Bottom
10501050
Mold Draft Angle Top
0.500.430.35.020.017.014BLead Width
0.200.150.09.008.006.004
c
Lead Thickness
10501050
Foot Angle
0.550.450.35.022.018.014LFoot Length
3.102.952.80.122.116.110DOverall Length
1.751.631.50.069.064.059E1Molded Package Width
3.002.802.60.118.110.102EOverall Width
0.150.080.00.006.003.000A1Standoff §
1.301.100.90.051.043.035A2Molded Package Thickness
1.451.180.90.057.046.035AOverall Height
1.90.075
p1
Outside lead pitch (basic)
0.95
.038
p
Pitch
55
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
1
p
D
B
n
E
E1
L
c
A2
A
A1
p1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-178
Drawing No. C04-091
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc. DS21451E-page 11
TC6501/2/3/4
Product Tape and Reel Specification
User Direction of Feed
P, Pitch
Standard Reel Component Orientation
Reverse Reel Component Orientation
W, Width
of Carrier
Tape
Pin 1
Pin 1
Device
Marking
TC6501/2/3/4
DS21451E-page 12 2002-2012 Microchip Technology Inc.
7.0 REVISION HISTORY
Revision E (December 2012)
Added a note to the package outline drawing.

TC6501P075VCTTRG

Mfr. #:
Manufacturer:
Microchip Technology
Description:
Board Mount Temperature Sensors w/Pin-Slctble Hyst
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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