AT97SC3204S-X2AC-10

Atmel AT24C256C
7
5294BSTPM9/10
28A3 TSSOP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
1/8/02
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
D 9.60 9.70 9.80 2, 5
E 8.10 BSC
E1 6.00 6.10 6.20 3, 5
A
1.20
A2 0.80 1.00 1.05
b 0.19
0.30 4
e 0.65 BSC
L 0.45 0.60 0.75
L1 1.00 REF
28A3, 28-lead, 6.1 x 9.7 mm Body, 0.65 pitch,
Thin Shrink Small Outline Package (TSSOP)
28A3
L1
A
L
D
A2
E
E1
e
b
Top View
Side View
End View
A
1. This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation DB for additional
information.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall
not exceed 0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed
0.25 mm (0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of
the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum
space between protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
Note:
8 Atmel AT24C256C
5294BSTPM9/10
40ML1 – QFN
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
A1
A3
A
A2
0
Side View
C40ML1
9/27/07
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
D 6.00 BSC
E 6.00 BSC
D2 3.95 4.10 4.25
E2 3.95 4.10 4.25
A - 0.85 0.90
A1 0.0 0.01 0.05
A2 - 0.65 0.70
A3 0.20 REF
L 0.30 0.40 0.50
e 0.50 BSC
b 0.18 0.23 0.30 2
D
E
Top View
N
2
3
1
Pin 1 Indicator
L
PIN1 ID
b
N
D2
3
2
1
e
Bottom View
E2
1. This drawing is for general information only. Refer to JEDEC Drawing MO-220, Variation WJJD-2, for proper
dimensions, tolerances, datums, etc.
2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal
tip. If the terminal has the optional radius on the other end of the terminal, the dimension should not be
measured in that radius area.
Note:
40ML1, , 40-lead 6.0 x 6.0 mm Body, 0.50 mm Pitch, Molded
Quad Flat No Lead Package (QFN) Punched
Atmel AT24C256C
9
5294BSTPM9/10
5. Revision History
Doc. Rev. Date Comments
5294BS 10/2010 Added Industrial Grade support detail
5294AS 01/2008 Initial document release

AT97SC3204S-X2AC-10

Mfr. #:
Manufacturer:
Microchip Technology / Atmel
Description:
Security ICs / Authentication ICs TPM SMBus COM 6.1MM 28-TSOP UNSIGN
Lifecycle:
New from this manufacturer.
Delivery:
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