ADG3241
Rev. B | Page 12 of 16
BUS SWITCH APPLICATIONS
MIXED VOLTAGE OPERATION, LEVEL
TRANSLATION
Bus switches can provide an ideal solution for interfacing
between mixed voltage systems. The ADG3241 is suitable for
applications where voltage translation from 3.3 V technology to
a lower voltage technology is needed. This device can translate
from 3.3 V to 1.8 V, from 2.5 V to 1.8 V, or bidirectionally from
3.3 V directly to 2.5 V.
Figure 27 shows a block diagram of a typical application in
which a user needs to interface between a 3.3 V ADC and a
2.5 V microprocessor. The microprocessor may not have 3.3 V
tolerant inputs, therefore placing the ADG3241 between the
two devices allows the devices to communicate easily. The bus
switch directly connects the two blocks, thus introducing
minimal propagation delay, timing skew, or noise.
3.3V ADC
2.5
V
3.3
V
ADG3241
3.3
V
2.5V
MICROPROCESSOR
04221-027
Figure 27. Level Translation Between a 3.3 V ADC and a 2.5 V Microprocessor
3.3 V TO 2.5 V TRANSLATION
When V
CC
is 3.3 V (
SEL
= 3.3 V) and the input signal range is
0 V to V
CC
, the maximum output signal will be clamped to
within a voltage threshold below the V
CC
supply.
ADG3241
2.5V
2.5V
3.3V
2.5V
3.3
V
04221-028
Figure 28. 3.3 V to 2.5 V Voltage Translation,
SEL
= V
CC
In this case, the output is limited to 2.5 V, as shown in Figure 29.
This device can be used for translation from 2.5 V to 3.3 V
devices and also between two 3.3 V devices.
.5
0V
3.3V
V
OUT
SWITCH
OUTPUT
SWITCH
INPUT
V
IN
3.3V SUPPLY
SEL = 3.3V
04221-029
Figure 29. 3.3 V to 2.5 V Voltage Translation,
SEL
= V
CC
2.5 V TO 1.8 V TRANSLATION
When V
CC
is 2.5 V (
SEL
= 2.5 V) and the input signal range is
0 V to V
CC
, the maximum output signal is, as before, clamped to
within a voltage threshold below the V
CC
supply. In this case, the
output is limited to approximately 1.8 V, as shown in Figure 31.
ADG3241
1.8V
2.5V
2.5
V
04221-030
Figure 30. 2.5 V to 1.8 V Voltage Translation,
SEL
= 2.5 V
CC
1.8V
0V
2.5V
V
OUT
SWITCH
OUTPUT
SWITCH
INPUT
V
IN
2.5V SUPPLY
SEL = 2.5V
04221-031
Figure 31. 2.5 V to 1.8 V Voltage Translation,
SEL
= V
CC
3.3 V TO 1.8 V TRANSLATION
The ADG3241 offers the option of interfacing between a 3.3 V
device and a 1.8 V device. This is possible through the use of
the
SEL
pin. The
SEL
pin is an active low control pin.
SEL
activates internal circuitry in the ADG3241 that allows voltage
translation between 3.3 V devices and 1.8 V devices.
ADG3241
1.8V
3
.3
V
3.3
V
04221-032
Figure 32. 3.3 V to 1.8 V Voltage Translation,
SEL
= 0 V
When V
CC
is 3.3 V and the input signal range is 0 V to V
CC
,
the maximum output signal is clamped to 1.8 V, as shown in
Figure 32. To do this, the
SEL
pin must be tied to Logic 0. If
SEL
is unused, it should be tied directly to V
CC
.
ADG3241
Rev. B | Page 13 of 16
CARD I/O
CARD I/O
RAM
CPU
ADG3241 ADG3241
PLUG-IN
CARD (1)
PLUG-IN
CARD (2)
BUS
04221-035
1.8V
0V
3.3V
V
OUT
SWITCH
OUTPUT
SWITCH
INPUT
V
IN
3.3V SUPPLY
SEL = 0V
04221-033
SEL
Figure 33. 3.3 V to 1.8 V Voltage Translation,
= 0 V
Figure 35. ADG3241 in a Hot Plug Application
BUS ISOLATION
A common requirement of bus architectures is low capacitance
loading of the bus. Such systems require bus bridge devices that
extend the number of loads on the bus without exceeding the
specifications. Because the ADG3241 is designed specifically for
applications that do not need drive yet require simple logic
functions, it solves this requirement. The device isolates access
to the bus, thus minimizing capacitance loading.
There are many systems, such as docking stations, PCI boards
for servers, and line cards for telecommunications switches, that
require the ability to handle hot swapping. If the bus can be
isolated prior to insertion or removal, there is more control over
the hot swap event. This isolation can be achieved using bus
switches. The bus switches are positioned on the hot swap card
between the connector and the devices. During hot swap, the
ground pin of the hot swap card must connect to the ground
pin of the backplane before any other signal or power pins.
BUS SWITCH
LOCATION
BUS/
BACKPLANE
LOAD A LOAD C
LOAD B LOAD D
04221-034
ANALOG SWITCHING
Bus switches can be used in many analog switching
applications, such as video graphics. Bus switches can have
lower on resistance, smaller on and off channel capacitance, and
thus improved frequency performance over their analog
counterparts.
Figure 34. Location of Bus Switched in a Bus Isolation Application
HOT PLUG AND HOT SWAP ISOLATION
The ADG3241 is suitable for hot swap and hot plug
applications. The output signal of the ADG3241 is limited to a
voltage that is below the V
CC
supply, as shown in
The bus switch channel itself, consisting solely of an NMOS
switch, limits the operating voltage (see
Figure 4 for a typical
plot), but in many cases this does not present an issue.
Figure 29,
Figure 31, and Figure 33. Therefore the switch acts like a buffer
to take the impact from hot insertion, protecting vital and
expensive chipsets from damage.
HIGH IMPEDANCE DURING POWER-UP/POWER-
DOWN
To ensure the high impedance state during power-up or power-
down,
In hot plug applications, the system cannot be shut down when
new hardware is being added. To overcome this, a bus switch
can be positioned on the backplane between the bus devices
and the hot plug connectors. The bus switch is turned off
during hot plug.
BE
should be tied to V
CC
through a pull-up resistor; the
minimum value of the resistor is determined by the current-
sinking capability of the driver.
Figure 35 shows a typical example of this type
of application.
ADG3241
Rev. B | Page 14 of 16
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-203-AB
0.22
0.08
0.30
0.15
1.00
0.90
0.70
SEATING
PLANE
4 5 6
3 2 1
PIN 1
0.65 BSC
1.30 BSC
0.10 MAX
0.10 COPLANARITY
0.40
0.10
1.10
0.80
2.20
2.00
1.80
2.40
2.10
1.80
1.35
1.25
1.15
0.46
0.36
0.26
Figure 36. 6-Lead Thin Shrink Small Outline Transistor Package [SC70]
(KS-6)
Dimensions shown in millimeters
SEATING
PLANE
0.60
0.57
0.53
12° MAX
TOP VIEW
0.34 MAX
0.27 NOM
0.18
0.17
0.13
BOTTOM
VIEW
1.70
1.66
1.50
1.30
1.20
1.10
1.70
1.65
1.50
1
3
5
6
2
4
0.10 NOM
0.05 MIN
0.20 MIN
0.50
BSC
0.25 MAX
0.17 MIN
0.30
0.23
0.10
0.26
0.19
0.11
PIN 1
Figure 37. 6-Lead Small Outline Transistor Package [SOT-66]
(RY-6-1)
Dimensions shown in millimeters
ORDERING GUIDE
Temperature
Range
Package
Option
Model Package Description Branding
ADG3241BKS-REEL7 −40°C to +85°C 6-Lead Thin Shrink Small Outline Transistor Package (SC70) KS-6 SKA
ADG3241BKS-500RL7 −40°C to +85°C 6-Lead Thin Shrink Small Outline Transistor Package (SC70) KS-6 SKA
ADG3241BKSZ-500RL7 −40°C to +85°C 6-Lead Thin Shrink Small Outline Transistor Package (SC70) KS-6 S19
1
ADG3241BKSZ-REEL7 −40°C to +85°C 6-Lead Thin Shrink Small Outline Transistor Package (SC70) KS-6 S19
1
ADG3241BKSZ-REEL −40°C to +85°C 6-Lead Thin Shrink Small Outline Transistor Package (SC70) KS-6 S19
1
ADG3241BRYZ-REEL7 −40°C to +85°C 6-Lead Small Outline Transistor Package (SOT-66) RY-6-1 00
1
1
Z = Pb-free part.

ADG3241BKSZ-500RL7

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Translation - Voltage Levels 2.5V/3.3V 1-Bit 2-Port Bus Switch
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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