www.ams.com/DC-DC_Step-Up/AS1340 Revision 1.20 1 - 17
AS1340
50V, Micropower, DC-DC Boost Converter
1 General Description
The AS1340 boost converter contains a 1.4A internal switch in a tiny
TDFN-8 3x3mm package. The device operates from a 2.7 to 5.5V
supply, and can boost voltages up to 50V output.
The output voltage can easily be adjusted by an external resistor
divider.
The AS1340 uses a unique control scheme providing the highest
efficiency over a wide range of load conditions. An internal 1.4A
MOSFET reduces external component count, and a fixed high
switching frequency (1MHz) allows for tiny surface-mount
components.
The AS1340 also features power-OK circuitry which monitors the
output voltage.
Additionally the AS1340 features a low quiescent supply current and
a shutdown mode to save power. During shutdown an output
disconnect switch separates the input from the output.
The AS1340 is ideal for LCD or OLED panels with low current
requirements and can also be used in a wide range of other
applications.
The device is available in a low-profile TDFN-8 3x3mm package.
Figure 1. AS1340 - Typical Application Diagram
2 Key Features
2.7V to 50V Adjustable Output Voltage
2.7V to 50V Input Voltage Range
2.7V to 5.5V Supply Voltage Range
High Output Currents:
- 100mA @ 12V from 3.3V V
IN
- 50mA @ 24V from 3.3V VIN
- 30mA @ 36V from 3.3V VIN

Efficiency: Up to 93%
Switching Frequency: 1MHz
Output Disconnect
Power-OK Output
Operating Supply Current: 30µA
Shutdown Current: 0.1µA
TDFN-8 3x3mm Package
3 Applications
The device is ideal for OLED display power supply, LED power
supply, LCD bias generators, mobile/cordless phones, palmtop
computers, PDAs and organizers, handy terminals or any other
portable, battery-powered device.
VIN = 2.7V
to 5.5V
1
EN
3
SWVIN
2
VCC
8
FB
4
POK
5
LX
On
Off
R2
R1
VOUT = > VIN to 50V
AS1340
L1
4.7µH
CIN
COUT
6
SWOUT
7, 9
GND
3
L1
6
LX
VCC
V
IN = 2.7V to
5.5V
3
L1
6
LX
VCC
V
IN = 2.7V to
5.5V
VIN = 2.7V to
~V
OUT
If not needed the output disconnect switch can be left unconnected which will also increase the efficiency.
Additionally the supply of the chip can be split to allow higher supply voltages for the coil. In this case the output disconnect switch must not be used.
VOUT
VOUT
www.ams.com/DC-DC_Step-Up/AS1340 Revision 1.20 2 - 17
AS1340
Datasheet - Pin Assignments
4 Pin Assignments
Figure 2. Pin Assignments (Top View)
4.1 Pin Descriptions
Table 1. Pin Descriptions
Pin Number Pin Name Description
1EN
Active-High Enable Input. A logic low on this pin shuts down the device and reduces the supply
current to 0.1µA.
Note: Connect to VCC for normal operation.
2VCC
+2.7V to +5.5V Supply Voltage. Bypass this pin to GND with a 1µF capacitor.
3SWVIN
Shutdown Disconnect Switch In
4POK
Power-OK.
0 = V
OUT < 90% of VOUTNOM.
1 = V
OUT > 90% of VOUTNOM.
5LX
Inductor. The drain of the internal N-channel MOSFET.
Note: This pin is high impedance in shutdown.
6SWOUT
Shutdown Disconnect Switch Out. Disconnects the input from the output during shutdown.
7GND
Ground. This pin and pin 9 must be connected to GND to ensure normal operation.
8FB
Feedback Pin. Feedback input to the g
m error amplifier. Connect a resistor divider tap to this pin. The
output voltage can be adjusted from V
IN to 50V by:
VOUT = 1.25V[1 + (R1/R2)]
9GND
Ground. This pin and pin 7 must be connected to GND to ensure normal operation.
5
LX
3SWVIN
2VCC
1
EN
8
FB
AS1340
4
POK
7GND
6SWOUT
9GND
www.ams.com/DC-DC_Step-Up/AS1340 Revision 1.20 3 - 17
AS1340
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter Min Max Units Comments
Electrical Parameters
VCC, FB, EN to GND
-0.3 7
VSWVIN, SWOUT to GND -0.3 7
LX to GND
55
Input Current (latch-up immunity) -100 100 mA Norm: JEDEC 78
Electrostatic Discharge
Electrostatic Discharge HBM 1.5 kV Norm: MIL 883 E method 3015
Temperature Ranges and Storage Conditions
Thermal Resistance
JA
36.7 ºC/W on PCB
Junction Temperature +150 ºC
Storage Temperature Range -55 +125 ºC
Package Body Temperature
+260
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020“Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State Surface
Mount Devices”.
The lead finish for Pb-free leaded packages is matte tin
(100% Sn).
Humidity non-condensing 5 85 %
Moisture Sensitive Level 1 Represents a max. floor life time of unlimited

AS1340A-BTDT-10

Mfr. #:
Manufacturer:
ams
Description:
Switching Voltage Regulators AS1340A-BTDT-10 Hyst Boost Conv 1.2W
Lifecycle:
New from this manufacturer.
Delivery:
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