LQH5BPB220MT0L

SpecNo.JELF243A-0108D-01 P4/8
MURATA MFG.CO., LTD
Reference Only
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
φ180 mm reel : 500 pcs. / reel
φ330 mm reel : 3000 pcs. / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Embossed carrier tape 10N min.
Cover tape 5N min.
9.4 Peeling off force of cover tape
Speed of Peeling off 300mm/min
Peeling off force
0.2 to 0.7N
(minimum value is typical)
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
« Packaging Code : L (φ180mm reel) »
« Packaging Code : K (φ330mm reel) »
(in mm)
165 to 180 degree
F
Cover tape
Plastic tape
190 min
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
210 min
φ
60±
1
0
17.0±1.4
φ
180±
0
3
13.0±
1
0
(in mm)
Trailer : 160 min.
Direction of feed
Empty tape
Leader
Cover tape
Label
φ
50min.
17.5±1.0
13.5±1.0
Trailer
Direction of feed
160min.
Label
Empty Tape
Cover tape
2 . 0 ± 0 .5
φ
13.0±0.2
φ
21.0±0.8
φ
330±2.0
210min..
190min.
Leader
SpecNo.JELF243A-0108D-01 P5/8
MURATA MFG.CO., LTD
Reference Only
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ・・・
1) <Expression of Inspection No.> □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y ()
(1) (2)
(1) RoHS regulation conformity
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (2) ,
Quantity, etc ・・・
9.8. Specification of Outer Case
Above Outer Case size is typical. It depends on a quantity of an order.
10. Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing (Reflow Soldering)
Recommended land patterns for reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
(in mm)
Reel
Outer Case Dimensions (mm)
Standard Reel Quantity
in Outer Case (Reel)
W D H
φ180mm 186 186 93 4
φ330mm 340 340 95 4
W
D
Label
H
Solder Resist
Chi
p
Colil
Land
4.1
1.8 1.85
5.5
SpecNo.JELF243A-0108D-01 P6/8
MURATA MFG.CO., LTD
Reference Only
11.2 Flux, Solder
Flux
Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder.
Standard thickness of solder paste : 100μm to 150μm
11.3 Soldering conditions (Reflow)
Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
100°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is
limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of
product quality.
Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245±3°C 260°C,10s
Cycle of reflow 2 times 2 times
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating 150°C,1 min
Tip temperature 380°C max.
Soldering iron output 80W max.
Tip diameter φ3mm max.
Soldering time 3(+1,-0)s
Times 2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the products due to the thermal shock.
11.5 Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Limit Profile
Standard Profile
90s±30s
230
260℃
245±3
220
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
Recommendable
Excessively

LQH5BPB220MT0L

Mfr. #:
Manufacturer:
Murata Electronics
Description:
Fixed Inductors 2020 22uH 20%
Lifecycle:
New from this manufacturer.
Delivery:
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