PLZ Series
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Vishay Semiconductors
Rev. 1.2. 29-Nov-16
1
Document Number: 84830
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, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Zener Diodes Permitting 500 mW Power Dissipation
FEATURES
• Sillicon planar Zener diodes, ultra small
• Low profile DO-219AC (MicroSMF) package
• Low leakage current
• Excellent stability
• High temperature soldering: 260 °C / 10 s at
terminals
• Wave and reflow solderable (reflow as per
JPC / JEDEC
®
J-STD 020) (double wave as
per IEC 61760-1)
• AEC-Q101 qualified available
• Base P/N-G3 - RoHS-compliant, green, industrial grade
•
Base P/N-HG3 - RoHS-compliant, green, AEC-Q101 qualified
• ESD immunity acc. IEC 61000-4-2 acc. to part table
• Surge performance acc. to part table
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
PRIMARY CHARACTERISTICS
PARAMETER VALUE UNIT
V
Z
range nom. 2.0 to 39 V
Test current I
ZT
5 to 20 mA
V
Z
specification Pulse current
Int. construction Single
ORDERING INFORMATION
DEVICE NAME ORDERING CODE TAPED UNITS PER REEL MINIMUM ORDER QUANTITY
PLZ-Series Part number-G3/H
4500 per 7" reel (8 mm tape) 22 500 / box
PLZ-Series Part number-HG3/H
PACKAGE
PACKAGE NAME WEIGHT
MOLDING COMPOUND
FLAMMABILITY RATING
MOISTURE SENSITIVITY LEVEL SOLDERING CONDITIONS
DO-219AC (MicroSMF) 4.8 mg UL 94 V-0 MSL level 1 (according J-STD-020) 260 °C / 10 s at terminals
ABSOLUTE MAXIMUM RATINGS (T
amb
= 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Power dissipation
Mounted on FR4 board 50 mm x 50 mm x 1.6 mm,
solder land 10 mm x 10 mm, T
amb
= 85 °C
P
tot
500
mWPower dissipation
Mounted on FR4 board 50 mm x 50 mm x 1.6 mm,
solder land 10 mm x 10 mm, T
amb
= 25 °C
P
tot
960
Power dissipation
Mounted on FR4 board with recommended soldering
footpads (reflow)
P
tot
340
Non-repetitive peak surge power dissipation
t
p
= 8/20 μs acc. IEC 61000-4-5 (PLZ5V1A to PLZ39D) P
ZSM
100 W
t
p
= 8/20 μs acc. IEC 61000-4-5 (PLZ2V0A to PLZ4V7C) P
ZSM
70 W
Z-current I
Z
P
tot
/V
Z
mA
Junction temperature T
j
150
°C
Storage temperature range T
stg
-55 to +150
THERMAL CHARACTERISTICS (T
amb
= 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Typ. thermal resistance junction to ambient air
Mounted on FR4 board 50 mm x 50 mm x 1.6 mm,
solder land 10 mm x 10 mm
R
thJA
130 K/W
Typ. thermal resistance junction to lead R
thJL
40 K/W
ELECTRICAL SPECIFICATIONS (T
amb
= 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT
Forward Voltage I
F
= 10 mA V
F
0.8 0.9 V