EMI8141, EMI8142, EMI8143
http://onsemi.com
9
PACKAGE DIMENSIONS
XDFN16 3.5x1.35, 0.4P
CASE 711AW
ISSUE A
0.25
1.55
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
1
0.55
15X
0.40
PITCH
0.65
12X
RECOMMENDED
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
A
B
E
D
BOTTOM VIEW
b
e
16X
0.10 B
0.05
AC
C
NOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
16X
A
A1
(A3)
0.08 C
0.10 C
C
SEATING
PLANE
SIDE VIEW
L
12X
1
8
916
DETAIL B
DETAIL A
DIM MIN MAX
MILLIMETERS
A 0.40 0.50
A1 0.00 0.05
A3 0.15 REF
b 0.15 0.25
D 3.50 BSC
L 0.40 0.60
E 1.35 BSC
e 0.40 BSC
L1 −−− 0.15
NOTE 4
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTION
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
L
e/2
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