853001AG 13 REV. A NOVEMBER 24, 2008
ICS853001
1:1, DIFFERENTIAL LVPECL-TO-
2.5V, 3.3V, 5V LVPECL/ECL BUFFER
3. Calculations and Equations.
The purpose of this section is to derive the power dissipated into the load.
LVPECL output driver circuit and termination are shown in
Figure 7.
To calculate worst case power dissipation into the load, use the following equations which assume a 50Ω load, and a termination
voltage of V
CC
- 2V.
For logic high, V
OUT
= V
OH_MAX
= V
CC_MAX
– 1.005V
(V
CC_MAX
- V
OH_MAX
)
= 1.005
For logic low, V
OUT
= V
OL_MAX
= V
CC_MAX
– 1.78V
(V
CC_MAX
- V
OL_MAX
)
= 1.78V
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
Pd_H = [(V
OH_MAX
– (V
CC_MAX
- 2V))/R
L
] * (V
CC_MAX
- V
OH_MAX
) = [(2V - (V
CC_MAX
- V
OH_MAX
))
/R
L
] * (V
CC_MAX
- V
OH_MAX
) =
[(2V - 1.005V)/50Ω] * 1.005V = 20mW
Pd_L = [(V
OL_MAX
– (V
CC_MAX
- 2V))/R
L
] * (V
CC_MAX
- V
OL_MAX
) = [(2V - (V
CC_MAX
- V
OL_MAX
))
/R
L
] * (V
CC_MAX
- V
OL_MAX
) =
[(2V - 1.78V)/50Ω] * 1.78V = 7.83mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 27.83mW
FIGURE 7. LVPECL DRIVER CIRCUIT AND T ERMINATION
VOUT
Q1
VCC - 2V
RL
50
VCC
853001AG 14 REV. A NOVEMBER 24, 2008
ICS853001
1:1, DIFFERENTIAL LVPECL-TO-
2.5V, 3.3V, 5V LVPECL/ECL BUFFER
RELIABILITY INFORMATION
TRANSISTOR COUNT
The transistor count for ICS853001 is: 141
TABLE 6A θ
JA
VS
. AIR FLOW T ABLE FOR 8 LEAD TSSOP
θθ
θθ
θ
JA
by Velocity (Meters per Second)
012
Multi-Layer PCB, JEDEC Standard Test Boards 101.7°C/W 90.5°C/W 89.8°C/W
TABLE 6B. θ
JA
VS
. AIR FLOW TABLE 8 LEAD SOIC
θθ
θθ
θ
JA
by Velocity (Linear Feet per Minute)
0 200 500
Single-Layer PCB, JEDEC Standard Test Boards 153.3°C/W 128.5°C/W 115.5°C/W
Multi-Layer PCB, JEDEC Standard Test Boards 112.7°C/W 103.3°C/W 97.1°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
853001AG 15 REV. A NOVEMBER 24, 2008
ICS853001
1:1, DIFFERENTIAL LVPECL-TO-
2.5V, 3.3V, 5V LVPECL/ECL BUFFER
PACKAGE OUTLINE - G SUFFIX FOR 8 LEAD TSSOP
T
ABLE 7A. PACKAGE DIMENSIONS
Reference Document: JEDEC Publication 95, MO-187
LOBMYS
sretemilliM
muminiMmumixaM
N8
A--01.1
1A0 51.0
2A97.079.0
b22.083.0
c80.032.0
DCISAB00.3
ECISAB09.4
1ECISAB00.3
eCISAB56.0
1
eCISAB59.1
L04.008.0
α
°8
aaa--01.0
PACKAGE OUTLINE - M SUFFIX FOR 8 LEAD SOIC
T
ABLE 7B. PACKAGE DIMENSIONS
Reference Document: JEDEC Publication 95, MS-012
LOBMYS
sretemilliM
NUMINIMMUMIXAM
N8
A53.157.1
1A01.052.0
B33.015.0
C91.052.0
D08.400.5
E08.300.4
eCISAB72.1
H08.502.6
h52.005.0
L04.07
2.1
α
°8

ICS853001AMLFT

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IC CLK BUFFER 1:1 2.5GHZ 8SOIC
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