8 2005 Semtech Corp. www.semtech.com
SC1565
POWER MANAGEMENT
Introduction
The SC1565 is intended for applications such as
graphics cards where high current capability and very low
dropout voltage are required. It provides a very simple,
low cost solution that uses very little pcb real estate.
Additional features include an enable pin to allow for a
very low power consumption standby mode, and a fully
adjustable output.
Component Selection
Input capacitor: a 4.7µF ceramic capacitor is
recommended. This allows for the device being some
distance from any bulk capacitance on the rail.
Additionally, input droop due to load transients is reduced,
improving load transient response. Additional capacitance
may be added if required by the application.
Output capacitor: a minimum bulk capacitance of 2.2µF,
along with a 0.1µF ceramic decoupling capacitor is
recommended. Increasing the bulk capacitance will
improve the overall transient response. The use of
multiple lower value ceramic capacitors in parallel to
achieve the desired bulk capacitance will not cause
stability issues. Although designed for use with ceramic
output capacitors, the SC1565 is extremely tolerant of
output capacitor ESR values and thus will also work
comfortably with tantalum output capacitors. For refer-
ence, the phase-margin contour of Figure 1 can be used
to choose an appropriate output capacitor for a given
stability requirement.
Noise immunity: in very electrically noisy environments,
it is recommended that 0.1µF ceramic capacitors be
placed from IN to GND and OUT to GND as close to the
device pins as possible.
External voltage selection resistors: the use of 1%
resistors, and designing for a current flow ≥ 10µA is
recommended to ensure a well regulated output (thus
R2 ≤ 120kΩ).
Applications Information
Thermal Considerations
The power dissipation in the SC1565 is approximately
equal to the product of the output current and the input
to output voltage differential:
OD
IVOUTVINP •−≈
The absolute worst-case dissipation is given by:
)MAX(Q)MAX()MAX(O)MIN()MAX()MAX(D
IVINIVOUTVINP •+•−=
For a typical scenario, V
IN
= 3.3V ± 5%, V
OUT
= 2.8V and
I
O
= 1.5A, therefore:
V
IN(MAX)
= 3.465V, V
OUT(MIN)
= 2.744V and I
Q(MAX)
= 1.75mA,
Thus P
D(MAX)
= 1.09W.
Using this figure, and assuming T
A(MAX)
= 70°C, we can
calculate the maximum thermal impedance allowable to
maintain T
J
≤ 150°C:
()
()
R
TT
P
CW
TH J A MAX
J MAX A MAX
DMAX
()( )
() ()
()
.
./
−
=
−
=
−
=°
150 70
109
73 4
This should be achievable for the SO-8 package using
pcb copper area to aid in conducting the heat away, such
as one square inch of copper connected to the ground
pins of the device. The SOT-223, TO-220 and TO-263
packages would not require heatsinking. Internal ground/
power planes and air flow will also assist in removing
heat. For higher ambient temperatures it may be neces-
sary to use additional copper area.
