23/25
XC6803
Series
● USP-6EL (DAF) Power Dissipation
Power dissipation data for the USP-6EL is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
Evaluation board layout (Unit: mm)
Board Mount (T
j
max = 125°C)
Ambient Temperature (°C)
Power Dissipation Pd（mW）
Thermal Resistance (°C/W)
25 750
133.33
85 300
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
2
in one side)
Copper (Cu) traces occupy 50% of the board area
in top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 mm Diameter
2. Power Dissipation vs. Ambient Temperature
Pd vs.Ta
0
100
200
300
400
500
600
700
800
25 45 65 85 105 125
Ambient Temperature: Ta（℃）
Power Dissipation: Pd（mW）
